Electronics-Integrated Circuits and Devices(Date:1995/12/15)

Presentation
表紙

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[Date]1995/12/15
[Paper #]
目次

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[Date]1995/12/15
[Paper #]
The latest packaging technology for portable consumer electronic products : The direction of the next generation package

Morihiro Kada,  

[Date]1995/12/15
[Paper #]ICD95-192
DESIGN AND FABRICATION OF OPTICALLY INTERCONNECTED PATTERN RECOGNITION SYSTEM

TAKESHI DOI,  TOHRU NAMBA,  AKIHITO UEHARA,  MAKOTO NAGATA,  SEIICHI MIYAZAKI,  KENTARO SHIBAHARA,  SHIN YOKOYAMA,  ATSUSHI IWATA,  TADASHI AE,  MASATAKA HIROSE,  

[Date]1995/12/15
[Paper #]ICD95-193
Analysis of plastic package water absorption during reflow soldering process

Eiji Yokota,  Yoshio Miura,  

[Date]1995/12/15
[Paper #]ICD95-194
Electrochemical Migration in Three Layer TAB Tape with Tin-plated Lead

Koji SHIBASAKI,  Chiaki TAKUBO,  Hiroshi TAZAWA,  Eiichi HOSOMI,  Toshio SUDO,  Morihiko IKEMIZU,  Youichi HIRUTA,  

[Date]1995/12/15
[Paper #]ICD95-195
Modeling Approach and Simulation of Simultaneous Switching Noise for Leadframe Packages

Masayuki MIURA,  Katsuto KATO,  Kenji ITO,  Yasuhiro YAMAJI,  Toshio SUDO,  

[Date]1995/12/15
[Paper #]ICD95-196
Electrical Modeling Approach of Simultaneous Switching Noise and Effective Inductance for Multilayer Packages

Katsuto KATO,  Kenji ITO,  Yasuhiro YAMAJI,  Toshio SUDO,  

[Date]1995/12/15
[Paper #]ICD95-197
Development of Tape BGA

Toshimi Kawahara,  Mitsunada Osawa,  Hiroyuki Ishiguro,  Yoshitsugu Kato,  Yuji Sakurai,  Shinya Nakaseko,  Takashi Hozumi,  Jyunichi Kasai,  

[Date]1995/12/15
[Paper #]ICD95-198
Development of New Structural MicroBGA/QFN

Yoshiyuki YONEDA,  Kazuto TSUJI,  Seiichi ORIMO,  Ryuji NOMOTO,  Hideharu SAKODA,  Masanori ONODERA,  Junichi KASAI,  

[Date]1995/12/15
[Paper #]ICD95-199
The development of System-module Technology

Tadaaki MIMURA,  Kenzo HATADA,  

[Date]1995/12/15
[Paper #]ICD95-200
[OTHERS]

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[Date]1995/12/15
[Paper #]