Presentation | 1995/12/15 The development of System-module Technology Tadaaki MIMURA, Kenzo HATADA, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We have suggested the novel device concept of "System module Technology", that can reduce the Cost of System-LSI's. This concept is realized by deviding large area LSI chips and stacking up one chip onto another chip. It has been understood the system module is to be able to down the cost from 1 chip to 20% or more by dividing, according to the verification of the effectiveness of the cost. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | System-LSI / Multichip-Module / Cost / functional devision |
Paper # | ICD95-200 |
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Conference Information | |
Committee | ICD |
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Conference Date | 1995/12/15(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Integrated Circuits and Devices (ICD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | The development of System-module Technology |
Sub Title (in English) | |
Keyword(1) | System-LSI |
Keyword(2) | Multichip-Module |
Keyword(3) | Cost |
Keyword(4) | functional devision |
1st Author's Name | Tadaaki MIMURA |
1st Author's Affiliation | Semiconductor Research Center, MATSUSHITA Electric Ind Co., Ltd.() |
2nd Author's Name | Kenzo HATADA |
2nd Author's Affiliation | Semiconductor Research Center, MATSUSHITA Electric Ind Co., Ltd. |
Date | 1995/12/15 |
Paper # | ICD95-200 |
Volume (vol) | vol.95 |
Number (no) | 427 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |