| Presentation | 1995/12/15 The latest packaging technology for portable consumer electronic products : The direction of the next generation package Morihiro Kada, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | IC package has been diversifying along with the development of electronic equipment. All of which makes it more difficult for package engineers as well as customers to decide which package will become main stream in future. This paper examines the mounting and assembly technologies employed in some of Japanese typical portable consumer electronic products -i.e. the camcorder, portable MD (mini-disk) recorder, Digital Cellular Phone, PHS (personal handy phone system) and PDA (personal digital assistants)-compared with those used for the notebook PC. IC packaging technology trends are also explored throughout the analysis. The portable consumer products will continue to use the SMD like SOP and QFP, while the usage of the newly developed BGA and CSP etc. will be limited to the equipment which requires very high pin count or high density mounting, |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | package / mounting / consumer electronic products / SMD / BGA / CSP |
| Paper # | ICD95-192 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1995/12/15(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | The latest packaging technology for portable consumer electronic products : The direction of the next generation package |
| Sub Title (in English) | |
| Keyword(1) | package |
| Keyword(2) | mounting |
| Keyword(3) | consumer electronic products |
| Keyword(4) | SMD |
| Keyword(5) | BGA |
| Keyword(6) | CSP |
| 1st Author's Name | Morihiro Kada |
| 1st Author's Affiliation | VLSI Laboratories Tenri Integrated Circuits group, Sharp Corporation() |
| Date | 1995/12/15 |
| Paper # | ICD95-192 |
| Volume (vol) | vol.95 |
| Number (no) | 427 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |