Electronics-Component Parts and Materials(Date:1996/12/12)

Presentation
表紙

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[Date]1996/12/12
[Paper #]
目次

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[Date]1996/12/12
[Paper #]
Self-Aligned Passivation Technology for On-Chip Copper Interconnection

Nobuyoshi Awaya,  Toshio Kobayashi,  

[Date]1996/12/12
[Paper #]CPM96-114
A New Terminal Connection Technique for igh-frequency Module

Nobuo Sato,  Masakaze Hosoya,  Hideki Tsunetsugu,  

[Date]1996/12/12
[Paper #]CPM96-115
Small Memory Card SSFDC (SmartMedia)

Hiroshi Iwasaki,  

[Date]1996/12/12
[Paper #]CPM96-116
Jissoh Design & Engineering CARD-PC

Norio Imaoka,  

[Date]1996/12/12
[Paper #]CPM96-117
Packaging Technology in Mobile Electronics

Seiichi Denda,  

[Date]1996/12/12
[Paper #]CPM96-118
Development of packaging technology for mini-notebook personal computers

Yoshinori Kamikava,  

[Date]1996/12/12
[Paper #]CPM96-119
Prospects for Future Packaging Technology of Module and LSIs

Kanji Otsuka,  Hiroshi Iwasaki,  Katsuya Kosuga,  Takashi Nukii,  Shogo Mizumoto,  Norio Imaoka,  

[Date]1996/12/12
[Paper #]CPM96-120
[OTHERS]

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[Date]1996/12/12
[Paper #]