Presentation 1996/12/12
A New Terminal Connection Technique for igh-frequency Module
Nobuo Sato, Masakaze Hosoya, Hideki Tsunetsugu,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) This report presents a high-frequency module with multi packages using a new terminal connection technique. This module consist of coaxial feedthrough packages, small coaxial connectors and film connectors with metal bumps. These film connectors and small coaxial connectors have high-frequency response; the return loss is more than 15dB and the insertion loss is less than 0.7dB from DC to 55 GHz, respectively. Three-dimensional electromagnetic field analysis showed that this module can achieve the high-frequency response same as the experimental results.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) high-hequency / package / module / film / connector / coaxial
Paper # CPM96-115
Date of Issue

Conference Information
Committee CPM
Conference Date 1996/12/12(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A New Terminal Connection Technique for igh-frequency Module
Sub Title (in English)
Keyword(1) high-hequency
Keyword(2) package
Keyword(3) module
Keyword(4) film
Keyword(5) connector
Keyword(6) coaxial
1st Author's Name Nobuo Sato
1st Author's Affiliation NTT Opto-electronics Laboratories()
2nd Author's Name Masakaze Hosoya
2nd Author's Affiliation NTT Opto-electronics Laboratories
3rd Author's Name Hideki Tsunetsugu
3rd Author's Affiliation NTT Opto-electronics Laboratories
Date 1996/12/12
Paper # CPM96-115
Volume (vol) vol.96
Number (no) 413
Page pp.pp.-
#Pages 8
Date of Issue