| Presentation | 1996/12/12 Self-Aligned Passivation Technology for On-Chip Copper Interconnection Nobuyoshi Awaya, Toshio Kobayashi, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Self-aligned passivation procedure for on chip copper interconnection has been developed to improve oxidation resistance. Al-Cu inter metallic compound was formed on copper wire by the annealing at 350C. The unreacted aluminum on SiO2 was selectively removed by a phosphoric acid treatment. Additional annealing in the gaseous mixture of H2 and O2 improved oxidation resistance of the passivation alloy. The increase in the resistance of the passivated copper wire pattern was also about 5%. The adhesion strength of plasma CVD SiO_2 on the copper was also improved by this method. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Integrated circuit / LSI / Interconnection / copper / alloy / Aluminum |
| Paper # | CPM96-114 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1996/12/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Self-Aligned Passivation Technology for On-Chip Copper Interconnection |
| Sub Title (in English) | |
| Keyword(1) | Integrated circuit |
| Keyword(2) | LSI |
| Keyword(3) | Interconnection |
| Keyword(4) | copper |
| Keyword(5) | alloy |
| Keyword(6) | Aluminum |
| 1st Author's Name | Nobuyoshi Awaya |
| 1st Author's Affiliation | NTT System Electronics Laboratories() |
| 2nd Author's Name | Toshio Kobayashi |
| 2nd Author's Affiliation | NTT System Electronics Laboratories |
| Date | 1996/12/12 |
| Paper # | CPM96-114 |
| Volume (vol) | vol.96 |
| Number (no) | 413 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |