Presentation 2012-08-02
Intra/Inter Tier Substrate Noise Measurements in 3D ICs
Yasumasa TAKAGI, Yuuki ARAGA, Makoto NAGATA, DER PLAS Geert VAN, Jaemin KIM, Nikolaos MINAS, Pol MARCHAL, Michael LIBOIS, MANNA Antonio LA, Wenqi ZHANG, Julien RYCKAERT, Eric BEYNE,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Substrate noise propagation among stacked dice is evaluated in a 3D test vehicle of 2 tier stacking. Each tier incorporates on-chip monitoring circuits and digital noise source circuits. Silicon measurements show that the substrate noise is attenuated in the propagation between tiers with through silicon vias (TSVs). The effect of p+ guard bands in the stack is also evaluated.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) 3D-LSI / TSV / On-chip testing
Paper # SDM2012-72,ICD2012-40
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Committee ICD
Conference Date 2012/7/26(1days)
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Paper Information
Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Intra/Inter Tier Substrate Noise Measurements in 3D ICs
Sub Title (in English)
Keyword(1) 3D-LSI
Keyword(2) TSV
Keyword(3) On-chip testing
1st Author's Name Yasumasa TAKAGI
1st Author's Affiliation Graduate school of system informatics, Kobe University()
2nd Author's Name Yuuki ARAGA
2nd Author's Affiliation Graduate school of system informatics, Kobe University
3rd Author's Name Makoto NAGATA
3rd Author's Affiliation Faculty of Engineering, Kobe University
4th Author's Name DER PLAS Geert VAN
4th Author's Affiliation IMEC
5th Author's Name Jaemin KIM
5th Author's Affiliation IMEC
6th Author's Name Nikolaos MINAS
6th Author's Affiliation IMEC
7th Author's Name Pol MARCHAL
7th Author's Affiliation IMEC
8th Author's Name Michael LIBOIS
8th Author's Affiliation IMEC
9th Author's Name MANNA Antonio LA
9th Author's Affiliation IMEC
10th Author's Name Wenqi ZHANG
10th Author's Affiliation IMEC
11th Author's Name Julien RYCKAERT
11th Author's Affiliation IMEC
12th Author's Name Eric BEYNE
12th Author's Affiliation IMEC
Date 2012-08-02
Paper # SDM2012-72,ICD2012-40
Volume (vol) vol.112
Number (no) 170
Page pp.pp.-
#Pages 6
Date of Issue