| Presentation | 2012-08-02 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems Fumito IMURA, Shunsuke NEMOTO, Naoya WATANABE, Fumiki KATO, Katsuya KIKUCHI, Hiroshi NAKAGAWA, Michiya HAGIMOTO, Hiroyuki UCHIDA, Takashi OMORI, Yasumori HIBI, Yukoh MATSUMOTO, Masahiro AOYAGI, |
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| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We have proposed the ultrawide-interchip-bus system for the interchip communication of the 3-dimentional stacked LSI systems. The ultrawide-interchip-bus is assembled in the center of the 3-D stacked LSI by interconnection of the TSVs and micro-bumps array. In this paper, the 3-D interconnect technology, which are achieved by the fabrication of low-capacitance TSVs and the low-stress bonding process of Au cone-bumps, on the basic concept of the ultrawide-interchips-bus system is reported. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 3D stacked LSI / TSV / Au cone-bump / 3D interconnect / Ultrawide interchip bus |
| Paper # | SDM2012-71,ICD2012-39 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2012/7/26(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems |
| Sub Title (in English) | |
| Keyword(1) | 3D stacked LSI |
| Keyword(2) | TSV |
| Keyword(3) | Au cone-bump |
| Keyword(4) | 3D interconnect |
| Keyword(5) | Ultrawide interchip bus |
| 1st Author's Name | Fumito IMURA |
| 1st Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST)() |
| 2nd Author's Name | Shunsuke NEMOTO |
| 2nd Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 3rd Author's Name | Naoya WATANABE |
| 3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 4th Author's Name | Fumiki KATO |
| 4th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 5th Author's Name | Katsuya KIKUCHI |
| 5th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 6th Author's Name | Hiroshi NAKAGAWA |
| 6th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 7th Author's Name | Michiya HAGIMOTO |
| 7th Author's Affiliation | TOPS Systems Corporation |
| 8th Author's Name | Hiroyuki UCHIDA |
| 8th Author's Affiliation | TOPS Systems Corporation |
| 9th Author's Name | Takashi OMORI |
| 9th Author's Affiliation | TOPS Systems Corporation |
| 10th Author's Name | Yasumori HIBI |
| 10th Author's Affiliation | TOPS Systems Corporation |
| 11th Author's Name | Yukoh MATSUMOTO |
| 11th Author's Affiliation | TOPS Systems Corporation |
| 12th Author's Name | Masahiro AOYAGI |
| 12th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| Date | 2012-08-02 |
| Paper # | SDM2012-71,ICD2012-39 |
| Volume (vol) | vol.112 |
| Number (no) | 170 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |