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Presentation |
2012-08-02 14:15
3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems Fumito Imura, Shunsuke Nemoto, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa (AIST), Michiya Hagimoto, Hiroyuki Uchida, Takashi Omori, Yasumori Hibi, Yukoh Matsumoto (TOPS Systems), Masahiro Aoyagi (AIST) |
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SDM2012-71 ICD2012-39 Link to ES Tech. Rep. Archives: SDM2012-71 ICD2012-39 |
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