Presentation 2011-10-20
On the relation between interface flattening effect and insulator breakdown characteristic of radical reaction based insulator formation technology
Rihito Kuroda, Akinobu Teramoto, Xiang Li, Tomoyuki Suwa, Shigetoshi Sugawa, Tadahiro Ohmi,
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Abstract(in English) Gate insulator films formed by radical reaction based insulator formation technology are known to exhibit lower leakage current across ultrathin gate insulator films and lower 1/f noise compared to thermal oxides. However, a high probability of gate insulator early breakdowns has been a big stumbling block to be solved. This paper reports on the suppression of early breakdown probability by the combination of radical oxidation and atomically flat Si surface, and its clarified mechanism of the improvement based on the interface flattening effect of the radical oxidation process.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Gate insulator film / Breakdown field / Lifetime / Flatness
Paper # SDM2011-101
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Conference Information
Committee SDM
Conference Date 2011/10/13(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) On the relation between interface flattening effect and insulator breakdown characteristic of radical reaction based insulator formation technology
Sub Title (in English)
Keyword(1) Gate insulator film
Keyword(2) Breakdown field
Keyword(3) Lifetime
Keyword(4) Flatness
1st Author's Name Rihito Kuroda
1st Author's Affiliation Graduate School of Engineering, Tohoku University()
2nd Author's Name Akinobu Teramoto
2nd Author's Affiliation NICHe, Tohoku University
3rd Author's Name Xiang Li
3rd Author's Affiliation Graduate School of Engineering, Tohoku University
4th Author's Name Tomoyuki Suwa
4th Author's Affiliation NICHe, Tohoku University
5th Author's Name Shigetoshi Sugawa
5th Author's Affiliation Graduate School of Engineering, Tohoku University:NICHe, Tohoku University
6th Author's Name Tadahiro Ohmi
6th Author's Affiliation NICHe, Tohoku University
Date 2011-10-20
Paper # SDM2011-101
Volume (vol) vol.111
Number (no) 249
Page pp.pp.-
#Pages 6
Date of Issue