Presentation 2011-10-27
Preparation of SiC MOS structure using SiO_2 Layer deposited by Thermal Decomposition of TEOS
Mitsunori HEMMI, Yuya IGUCHI, Takashi SAKAI, Akihiko SUGITA, Tomohiko YAMAKAMI, Rinpei HAYASHIBE, Kiichi KAMIMURA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) A oxide layer was deposited on a SiC surface by thermal chemical vapor deposition as a source material TEOS. After the deposition of the oxide layer , samples were annealed in N_2 atmosphere and H_2 atmosphere. The metal-oxide-semiconductor capacitor was formed to measure the interface properties between SiC surface and oxide layer and the properties of the defects in oxide layer. The lowest interface state density was obtained for the sample annealed N_2 atmosphere. The interface state density of those sample was 1.5×10^<11>cm^<-2>eV^<-1> at 0.2eV below the conduction band edge. The fixed oxide charge in oxide layer has been decreased by H_2 annealing. Annealed TEOS oxide layer will caused improvement of SiO_2/SiC interface properties and reduction of defects in oxide layer.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) SiC / TEOS / MOS / interface states / fixed oxide charge
Paper # CPM2011-119
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Conference Information
Committee CPM
Conference Date 2011/10/19(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Preparation of SiC MOS structure using SiO_2 Layer deposited by Thermal Decomposition of TEOS
Sub Title (in English)
Keyword(1) SiC
Keyword(2) TEOS
Keyword(3) MOS
Keyword(4) interface states
Keyword(5) fixed oxide charge
1st Author's Name Mitsunori HEMMI
1st Author's Affiliation Faculty of Engineering, Shinshu University()
2nd Author's Name Yuya IGUCHI
2nd Author's Affiliation Faculty of Engineering, Shinshu University
3rd Author's Name Takashi SAKAI
3rd Author's Affiliation Faculty of Engineering, Shinshu University
4th Author's Name Akihiko SUGITA
4th Author's Affiliation Faculty of Engineering, Shinshu University
5th Author's Name Tomohiko YAMAKAMI
5th Author's Affiliation Faculty of Engineering, Shinshu University
6th Author's Name Rinpei HAYASHIBE
6th Author's Affiliation Faculty of Engineering, Shinshu University
7th Author's Name Kiichi KAMIMURA
7th Author's Affiliation Faculty of Engineering, Shinshu University
Date 2011-10-27
Paper # CPM2011-119
Volume (vol) vol.111
Number (no) 264
Page pp.pp.-
#Pages 4
Date of Issue