Presentation 2009-10-29
A study on Improvement of Thermal Stability for PtSi Alloying with Hf Utilizing Two-Step Silicidation Process
Jun GAO, Jumpei ISHIKAWA, Shun-ichiro OHMI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) To improve the thermal stability of Pt_xHf_ySi formed at 400℃/60min, 2-step silicidation process was investigated. By using a rapid thermal annealing (RTA) system, the Pt/Hf/n-Si(100) stacked layers were annealed at 400℃ for 60min and then re-annealed at 550-750℃ for 1min in a flowing N_2 ambient to form silicide layer. In the case of silicide layer formed at 400℃/60min, it was found that sheet resistance deteriorated to 30-40Ω/sq and barrier height became 0.75eV at the temperature of 550℃ or higher. On the other hand, In the case of Pt_xHf_ySi formed at 2-step silicidation, it was found that barrier height is kept at 0.65eV and low sheet resistance (30Ω/sq) is obtained, even after 700℃ re-anneal.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) PtSi / Monosilicide / Alloy / Barrier Height / Workfunction / Sheet resistance / 2-step silicidation
Paper # SDM2009-118
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Conference Information
Committee SDM
Conference Date 2009/10/22(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A study on Improvement of Thermal Stability for PtSi Alloying with Hf Utilizing Two-Step Silicidation Process
Sub Title (in English)
Keyword(1) PtSi
Keyword(2) Monosilicide
Keyword(3) Alloy
Keyword(4) Barrier Height
Keyword(5) Workfunction
Keyword(6) Sheet resistance
Keyword(7) 2-step silicidation
1st Author's Name Jun GAO
1st Author's Affiliation Dept. of Electronics and Applied Physics, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology()
2nd Author's Name Jumpei ISHIKAWA
2nd Author's Affiliation Dept. of Electronics and Applied Physics, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology
3rd Author's Name Shun-ichiro OHMI
3rd Author's Affiliation Dept. of Electronics and Applied Physics, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology
Date 2009-10-29
Paper # SDM2009-118
Volume (vol) vol.109
Number (no) 257
Page pp.pp.-
#Pages 4
Date of Issue