Presentation 2009-08-10
Fabrication of SiC MIS structure using direct nitridation layer as an interfacial layer
Shin'ichiro SUZUKI, Akira SENGOKU, Takuma TSUJI, Mitsunori HENMI, Yusuke MURATA, Tomohiko YAMAKAMI, Rinpei HAYASHIBE, Kiichi KAMIMURA,
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Abstract(in English) Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface state density was the order of 10^<12>cm^<-2>eV^<-1>, and was same order to the value for the sample carefully prepared by oxidation and post oxidation annealing. The interface state density determined from n was consistent to the value calculated from the capacitance voltage curve of SiO_2/nitride/SiC MIS diode by Terman method. High temperature nitridation was effective to reduce the interface state density.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) SiC / Nitride / Interface / MIS Schottky
Paper # CPM2009-35
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Committee CPM
Conference Date 2009/8/3(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Fabrication of SiC MIS structure using direct nitridation layer as an interfacial layer
Sub Title (in English)
Keyword(1) SiC
Keyword(2) Nitride
Keyword(3) Interface
Keyword(4) MIS Schottky
1st Author's Name Shin'ichiro SUZUKI
1st Author's Affiliation Faculty of Engineering, Shinshu University()
2nd Author's Name Akira SENGOKU
2nd Author's Affiliation Faculty of Engineering, Shinshu University
3rd Author's Name Takuma TSUJI
3rd Author's Affiliation Faculty of Engineering, Shinshu University
4th Author's Name Mitsunori HENMI
4th Author's Affiliation Faculty of Engineering, Shinshu University
5th Author's Name Yusuke MURATA
5th Author's Affiliation Faculty of Engineering, Shinshu University
6th Author's Name Tomohiko YAMAKAMI
6th Author's Affiliation Faculty of Engineering, Shinshu University
7th Author's Name Rinpei HAYASHIBE
7th Author's Affiliation Faculty of Engineering, Shinshu University
8th Author's Name Kiichi KAMIMURA
8th Author's Affiliation Faculty of Engineering, Shinshu University
Date 2009-08-10
Paper # CPM2009-35
Volume (vol) vol.109
Number (no) 171
Page pp.pp.-
#Pages 4
Date of Issue