Presentation | 2006-12-22 Millimeter-wave Transmission Line through Silicon Substrate for Solder Seal Package Takeshi YUASA, Yukihiro TAHARA, Hideyuki OH-HASHI, Shimpei OGAWA, Yoshio FUJII, Hiroshi FUKUMOTO, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | A transmission line structure through silicon substrate for solder seal package has been investigated. In order to achieve upper direction feed-through, we adopt a silicon pillar formed by etching cavity as a signal line. Simulation results in millimeter wave band have shown low insertion loss, and the proposed transmission line structure is suitable for high density millimeter wave modules based on silicon substrates. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Silicon / Solder / Millimeter wave / Package |
Paper # | MW2006-148 |
Date of Issue |
Conference Information | |
Committee | MW |
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Conference Date | 2006/12/15(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Chair | |
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Paper Information | |
Registration To | Microwaves (MW) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Millimeter-wave Transmission Line through Silicon Substrate for Solder Seal Package |
Sub Title (in English) | |
Keyword(1) | Silicon |
Keyword(2) | Solder |
Keyword(3) | Millimeter wave |
Keyword(4) | Package |
1st Author's Name | Takeshi YUASA |
1st Author's Affiliation | Information Technology R&D Center, Mitsubishi Electric Corporation() |
2nd Author's Name | Yukihiro TAHARA |
2nd Author's Affiliation | Information Technology R&D Center, Mitsubishi Electric Corporation |
3rd Author's Name | Hideyuki OH-HASHI |
3rd Author's Affiliation | Information Technology R&D Center, Mitsubishi Electric Corporation |
4th Author's Name | Shimpei OGAWA |
4th Author's Affiliation | Advanced Technology R&D Center, Mitsubishi Electric Corporation |
5th Author's Name | Yoshio FUJII |
5th Author's Affiliation | Advanced Technology R&D Center, Mitsubishi Electric Corporation |
6th Author's Name | Hiroshi FUKUMOTO |
6th Author's Affiliation | Advanced Technology R&D Center, Mitsubishi Electric Corporation |
Date | 2006-12-22 |
Paper # | MW2006-148 |
Volume (vol) | vol.106 |
Number (no) | 447 |
Page | pp.pp.- |
#Pages | 4 |
Date of Issue |