Presentation 2006-12-22
Millimeter-wave Transmission Line through Silicon Substrate for Solder Seal Package
Takeshi YUASA, Yukihiro TAHARA, Hideyuki OH-HASHI, Shimpei OGAWA, Yoshio FUJII, Hiroshi FUKUMOTO,
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Abstract(in English) A transmission line structure through silicon substrate for solder seal package has been investigated. In order to achieve upper direction feed-through, we adopt a silicon pillar formed by etching cavity as a signal line. Simulation results in millimeter wave band have shown low insertion loss, and the proposed transmission line structure is suitable for high density millimeter wave modules based on silicon substrates.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Silicon / Solder / Millimeter wave / Package
Paper # MW2006-148
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Conference Information
Committee MW
Conference Date 2006/12/15(1days)
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Registration To Microwaves (MW)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Millimeter-wave Transmission Line through Silicon Substrate for Solder Seal Package
Sub Title (in English)
Keyword(1) Silicon
Keyword(2) Solder
Keyword(3) Millimeter wave
Keyword(4) Package
1st Author's Name Takeshi YUASA
1st Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation()
2nd Author's Name Yukihiro TAHARA
2nd Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
3rd Author's Name Hideyuki OH-HASHI
3rd Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
4th Author's Name Shimpei OGAWA
4th Author's Affiliation Advanced Technology R&D Center, Mitsubishi Electric Corporation
5th Author's Name Yoshio FUJII
5th Author's Affiliation Advanced Technology R&D Center, Mitsubishi Electric Corporation
6th Author's Name Hiroshi FUKUMOTO
6th Author's Affiliation Advanced Technology R&D Center, Mitsubishi Electric Corporation
Date 2006-12-22
Paper # MW2006-148
Volume (vol) vol.106
Number (no) 447
Page pp.pp.-
#Pages 4
Date of Issue