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Presentation |
2006-12-22 13:50
Millimeter-wave Transmission Line through Silicon Substrate for Solder Seal Package Takeshi Yuasa, Yukihiro Tahara, Hideyuki Oh-hashi, Shimpei Ogawa, Yoshio Fujii, Hiroshi Fukumoto (Mitsubishi Electric Corp.) |
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Link to ES Tech. Rep. Archives: MW2006-148 |
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