| Presentation | 2006-06-27 60GHz Subharmonic Mixer Module Using Stud Bump Bonding Technology Kohei MASUDA, Futoshi TAKEUCHI, Yasuhiro HAMADA, Kenichi MARUHASHI, Hiroshi OGUMA, Suguru KAMEDA, Hiroyuki NAKASE, Tadashi TAKAGI, Kazuo TSUBOUCHI, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | 60-GHz band is expected to be used for wireless personal area network with a data rate of more than 3Gbit/s. We are aiming to fabricate ultra-small and low-cost wireless 3-dimentional system-in-package including 60GHz radio frequency components. A 60-GHz-band Integrated Circuit (IC) was mounted on an any layer interstitial via hole (ALIVH) substrate using stud bump bonding technology. Both single and double balanced mixer ICs using antiparallel diode pair were fabricated on GaAs substrates. Characteristics of fabricated mixer ICs in a package were measured. Measured conversion loss of both mixers was 20dB. Degradation of packaged mixer ICs characteristics was found to be negligibly small compared with bare chip characteristics. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | millimeter-wave / wireless module / flip-chip bonding / SBB (Stud Bump Bonding) |
| Paper # | MW2006-27 |
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| Conference Information | |
| Committee | MW |
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| Conference Date | 2006/6/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Microwaves (MW) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 60GHz Subharmonic Mixer Module Using Stud Bump Bonding Technology |
| Sub Title (in English) | |
| Keyword(1) | millimeter-wave |
| Keyword(2) | wireless module |
| Keyword(3) | flip-chip bonding |
| Keyword(4) | SBB (Stud Bump Bonding) |
| 1st Author's Name | Kohei MASUDA |
| 1st Author's Affiliation | Research Institute of Electrical Communication, Tohoku University() |
| 2nd Author's Name | Futoshi TAKEUCHI |
| 2nd Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 3rd Author's Name | Yasuhiro HAMADA |
| 3rd Author's Affiliation | System Devices Research Laboratories, NEC Corporation |
| 4th Author's Name | Kenichi MARUHASHI |
| 4th Author's Affiliation | System Devices Research Laboratories, NEC Corporation |
| 5th Author's Name | Hiroshi OGUMA |
| 5th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 6th Author's Name | Suguru KAMEDA |
| 6th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 7th Author's Name | Hiroyuki NAKASE |
| 7th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 8th Author's Name | Tadashi TAKAGI |
| 8th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 9th Author's Name | Kazuo TSUBOUCHI |
| 9th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| Date | 2006-06-27 |
| Paper # | MW2006-27 |
| Volume (vol) | vol.106 |
| Number (no) | 129 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |