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Presentation |
2006-06-27 11:20
60GHz Subharmonic Mixer Module Using Stud Bump Bonding Technology Kohei Masuda, Futoshi Takeuchi (Tohoku Univ.), Yasuhiro Hamada, Kenichi Maruhashi (NEC), Hiroshi Oguma, Suguru Kameda, Hiroyuki Nakase, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) |
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Link to ES Tech. Rep. Archives: MW2006-27 |
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