Electronics-Silicon Devices and Materials(Date:2020/02/07)

Presentation
[Invited Talk] Stability of Cu Interconnect Surface after post CMP Cleaning

Yasuhiro Kawase(MCC),  Toshiaki Shibata(MCC),  Tomohiro Kusano(MCC),  Ken Harada(imec),  Kan Takeshita(MCC),  

[Date]2020-02-07
[Paper #]SDM2019-90
Formation of passivation layer on Cu and Co surfaces in BTA-H2O2 aqueous solutions

Kondoh, Eiichi(Univ. Yamanashi),  Toyama, Mao(Univ. Yamanashi),  Takeuchi, Shota(Univ. Yamanashi),  Jin, Lianhua(Univ. Yamanashi),  Ryota Koshino(Ebara Corp.),  Hamada, Satomi(Ebara Corp.),  Shima, Shohei(Ebara Corp.),  Hiyama, Hirokuni(Ebara Corp.),  

[Date]2020-02-07
[Paper #]SDM2019-88
[Invited Talk] Impact of Homogeneously Dispersed Al Nanoclusters by Si-monolayer Insertion into Hf0.5Zr0.5O2 Film on FeFET Memory Array with Tight Threshold Voltage Distribution

Tadashi Yamaguchi(Renesas),  Keiichi Maekawa(Renesas),  Takahiro Ohara(Renesas),  Atsushi Amo(Renesas),  Eiji Tsukuda(Renesas),  Kenichiro Sonoda(Renesas),  Hiroshi Yanagita(Renesas),  Masao Inoue(Renesas),  Masazumi Matsuura(Renesas),  Tomohiro Yamashita(Renesas),  

[Date]2020-02-07
[Paper #]SDM2019-89
[Invited Talk] Thermal Boundary Resistance of Metal/Dielectric Interfaces in Silicon Nanowire Thermoelectric Generators

Tianzhuo Zhan(Waseda Univ.),  

[Date]2020-02-07
[Paper #]SDM2019-96
[Invited Talk] Novel Volatile Film for Precise Dual Damascene Fabrication

Makoto Fujikawa(TTS),  Tatsuya Yamaguchi(TTS),  Yuki Kikuchi(TTCA),  Kaoru Maekawa(TTCA),  Hiroaki Kawasaki(TEL),  Yoji Iizuka(TEL),  

[Date]2020-02-07
[Paper #]SDM2019-92
[Special Invited Talk] Possibility of intermetallic compounds for ultra-small scale interconnections

Junichi Koike(Tohoku Univ),  Linghan Chen(Tohoku Univ),  Shinji Yokogawa(Univ. Elec-Comm),  

[Date]2020-02-07
[Paper #]SDM2019-93
[Invited Talk] Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packaging

Murugesan Mariappan(Tohoku Univ.),  Takafumi Fukushima(Tohoku Univ.),  

[Date]2020-02-07
[Paper #]SDM2019-91
[Invited Talk] Solution-processed interconnections using vacuum ultraviolet

Takeo Minari(NIMS),  Wanli Li(NIMS),  Qingqing Sun(NIMS),  Lingying Li(NIMS),  Xuying Liu(Zhengzhou Univ.),  Masayuki Kanehara(C-INK),  

[Date]2020-02-07
[Paper #]SDM2019-94
[Invited Talk] A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION

Yasuhisa Kayaba(MCI),  Yuzo Nakamura(MCI),  Jun Kamada(MCI),  Takashi Kozeki(MCI),  Kazuo Kohmura(MCI),  

[Date]2020-02-07
[Paper #]SDM2019-95
[Invited Talk] Nanophotonics contributions to state-of-the-art CMOS Image Sensors

Sozo Yokogawa(SSS),  

[Date]2020-02-07
[Paper #]SDM2019-97