Electronics-Component Parts and Materials(Date:1997/12/11)

Presentation
表紙

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[Date]1997/12/11
[Paper #]
目次

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[Date]1997/12/11
[Paper #]
Bonding Technology for interconnection adopted Anisotropic Conductive Film : Application of the LED print head

Hiroshi Tohyama,  Yuko Kitayama,  Susumu Ozawa,  

[Date]1997/12/11
[Paper #]CPM97-138
Flip Chip Bonding Technique Using Anisotropic Conductive Films

Tsuneo Hamaguchi,  Hirozo Tsuruta,  Mitsunori Ishizaki,  Kenji Kagata,  

[Date]1997/12/11
[Paper #]CPM97-139
Ultra High-Speed GaAs MESFET IC Modules using Flip Chip Bonding Technique

Hiroyuki Kikuchi,  Hideki Tsunetsugu,  Makoto Hirano,  Yuhki Imai,  

[Date]1997/12/11
[Paper #]CPM97-140
Improvement of Solder Joint Reliability between Multilayer Ceramic Package and Printed Wiring Board by New Ceramic Material

Noriaki Hamada,  Kouichi Yamaguchi,  Masahiko Higashi,  Hideto Yonekura,  Masanari Kokubu,  

[Date]1997/12/11
[Paper #]CPM97-141
Deposition type solder using chemical reaction

Masanao Kono,  Hisao Irie,  

[Date]1997/12/11
[Paper #]CPM97-142
Advenced Cooling System by Heat Pipes for PC

Masataka Mochizuki,  

[Date]1997/12/11
[Paper #]CPM97-143
Fabrication of Microbumps by Electroless Plating

Hideto WATANABE,  Atsushi ASANO,  Hideo HONMA,  

[Date]1997/12/11
[Paper #]CPM97-144
Shape Evolution of Electrodeposited Bumps : Effect of Resist Angle

Kazuo Kondo,  Zennosuke Tanaka,  Keisuke Fukui,  

[Date]1997/12/11
[Paper #]CPM97-145
Formation Method and Characteristics of Build Up Printed Circuit Boards with Via Post.

Takeshi KOBAYASHI,  Satoshi ITAYA,  Hideo HONMA,  

[Date]1997/12/11
[Paper #]CPM97-146
Development of SOC Package and SOC 3D Package Module

Tetsuya FUJISAWA,  Yoshihiko IKEMOTO,  Hiroshi INOUE,  Yoshitsugu KATOH,  Masa-aki SEKI,  Sei-ichi ORIMO,  Toyoshige KAWASHIMA,  Mitsutaka SATOH,  Toshio HAMANO,  Jun-ichi KASAI,  

[Date]1997/12/11
[Paper #]CPM97-147
Reliabihty design which uses FEM analysis for thick film substrate

Takashi Nagasaka,  Yuji Ootani,  Kengo Oka,  

[Date]1997/12/11
[Paper #]CPM97-148
High-Speed Public Key Cryptosystem with Residue Arithmetic Calculator Easily Expandable to Any Accuracy.

Tsugio Nakamura,  Hiroaki Ohishi,  Hiroshi Kasahara,  

[Date]1997/12/11
[Paper #]CPM97-149
[OTHERS]

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[Date]1997/12/11
[Paper #]