Presentation | 1997/12/11 Reliabihty design which uses FEM analysis for thick film substrate Takashi Nagasaka, Yuji Ootani, Kengo Oka, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | For a thick film substrate, residual stress occurs at the connections of different material on the substrate. We understood that cracks occur due to the stress and a resistance value change of the resistors occur. The author clarified the causes based on a FEM analysis result of a substrate cross-section design and reviewed countermeasures. As a result, we were able to decrease the residual stress mentioned above and prevent the occurrence of cracks by optimizing the thermal expansion coefficient of each material. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Thick Film Substrate / Tensile Stress / FEM / Resistance Drift / TCE |
Paper # | CPM97-148 |
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Conference Information | |
Committee | CPM |
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Conference Date | 1997/12/11(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
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Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Reliabihty design which uses FEM analysis for thick film substrate |
Sub Title (in English) | |
Keyword(1) | Thick Film Substrate |
Keyword(2) | Tensile Stress |
Keyword(3) | FEM |
Keyword(4) | Resistance Drift |
Keyword(5) | TCE |
1st Author's Name | Takashi Nagasaka |
1st Author's Affiliation | Electronics R&D Dept., DENSO CORPORATION() |
2nd Author's Name | Yuji Ootani |
2nd Author's Affiliation | Electronics R&D Dept., DENSO CORPORATION |
3rd Author's Name | Kengo Oka |
3rd Author's Affiliation | Electronics R&D Dept., DENSO CORPORATION |
Date | 1997/12/11 |
Paper # | CPM97-148 |
Volume (vol) | vol.97 |
Number (no) | 433 |
Page | pp.pp.- |
#Pages | 7 |
Date of Issue |