Presentation 1997/12/11
Reliabihty design which uses FEM analysis for thick film substrate
Takashi Nagasaka, Yuji Ootani, Kengo Oka,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) For a thick film substrate, residual stress occurs at the connections of different material on the substrate. We understood that cracks occur due to the stress and a resistance value change of the resistors occur. The author clarified the causes based on a FEM analysis result of a substrate cross-section design and reviewed countermeasures. As a result, we were able to decrease the residual stress mentioned above and prevent the occurrence of cracks by optimizing the thermal expansion coefficient of each material.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Thick Film Substrate / Tensile Stress / FEM / Resistance Drift / TCE
Paper # CPM97-148
Date of Issue

Conference Information
Committee CPM
Conference Date 1997/12/11(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Reliabihty design which uses FEM analysis for thick film substrate
Sub Title (in English)
Keyword(1) Thick Film Substrate
Keyword(2) Tensile Stress
Keyword(3) FEM
Keyword(4) Resistance Drift
Keyword(5) TCE
1st Author's Name Takashi Nagasaka
1st Author's Affiliation Electronics R&D Dept., DENSO CORPORATION()
2nd Author's Name Yuji Ootani
2nd Author's Affiliation Electronics R&D Dept., DENSO CORPORATION
3rd Author's Name Kengo Oka
3rd Author's Affiliation Electronics R&D Dept., DENSO CORPORATION
Date 1997/12/11
Paper # CPM97-148
Volume (vol) vol.97
Number (no) 433
Page pp.pp.-
#Pages 7
Date of Issue