Electronics-Integrated Circuits and Devices(Date:2008/01/10)

Presentation
A multi-layer wafer-level 5-μm-thick Cu wiring technology with photosensitive resin

Katsumi KIKUCHI,  Kouji SOEJIMA,  Yasuhiro ISHII,  Masaya KAWANO,  Masayuki MIZUNO,  Shintaro YAMAMICHI,  

[Date]2008/1/10
[Paper #]CPM2007-146,ICD2007-157
A method of Ultra-fine Pad Interconnection using Electroless Deposition

Tokihiko YOKOSHIMA,  Yasuhiro YAMAJI,  Yuichiro TAMURA,  Katsuya KIKUCHI,  Hiroshi NAKAGAWA,  Masahiro AOYAGI,  

[Date]2008/1/10
[Paper #]CPM2007-147,ICD2007-158
Reliability evaluation of lead free solder joint against vibration load under thermal circumstance

Michiya Matsushima,  Toshiyuki Hamano,  Kiyokazu Yasuda,  Kozo Fujimoto,  

[Date]2008/1/10
[Paper #]CPM2007-148,ICD2007-159
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[Date]2008/1/10
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