| Presentation | 2008-01-18 A multi-layer wafer-level 5-μm-thick Cu wiring technology with photosensitive resin Katsumi KIKUCHI, Kouji SOEJIMA, Yasuhiro ISHII, Masaya KAWANO, Masayuki MIZUNO, Shintaro YAMAMICHI, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We have successfully developed a multi-layer wafer-level 5-um-thick Cu wiring technology and an embedded on-chip capacitor technology with anodized Al_2O_3. We observed that our wafer-level Cu wiring technology improved IR-drop five times as small as conventional LSI, and our anodized Al_2O_3 capacitor technology obtained noise reduction of 20 dBμA over 200 MHz. These technologies are believed to provide not only advanced LSIs with stable power supply wirings and higher speed operation, but also connectivity between LSIs and packaging substrates. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Photosensitive resin / Cu electroplate / Anodization / Alumina |
| Paper # | CPM2007-146,ICD2007-157 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2008/1/10(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A multi-layer wafer-level 5-μm-thick Cu wiring technology with photosensitive resin |
| Sub Title (in English) | |
| Keyword(1) | Photosensitive resin |
| Keyword(2) | Cu electroplate |
| Keyword(3) | Anodization |
| Keyword(4) | Alumina |
| 1st Author's Name | Katsumi KIKUCHI |
| 1st Author's Affiliation | NEC Corporation() |
| 2nd Author's Name | Kouji SOEJIMA |
| 2nd Author's Affiliation | NEC Electronics Corporation |
| 3rd Author's Name | Yasuhiro ISHII |
| 3rd Author's Affiliation | NEC Corporation |
| 4th Author's Name | Masaya KAWANO |
| 4th Author's Affiliation | NEC Electronics Corporation |
| 5th Author's Name | Masayuki MIZUNO |
| 5th Author's Affiliation | NEC Corporation |
| 6th Author's Name | Shintaro YAMAMICHI |
| 6th Author's Affiliation | NEC Corporation |
| Date | 2008-01-18 |
| Paper # | CPM2007-146,ICD2007-157 |
| Volume (vol) | vol.107 |
| Number (no) | 426 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |