Thu, Nov 14 PM 14:00 - 16:30 |
(1) |
14:00-14:25 |
Newest non-destructive X-ray inspection technology of conducting research and development and failure analysis
-- It introduces from the foundation to application. -- |
Masahito Natsuhara (shimadzu) |
(2) |
14:25-14:50 |
Effective non-destructive defect localization by using Enhanced Lock-In Thermography |
Toshinobu Nagatomo (DCG Systems) |
(3) |
14:50-15:15 |
Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress |
Akira Saito, Akira Okamoto, Yoshihiro Iwahori, Makoto Ogawa (Mutrata MFG), Akihiro Motoki (Sabae Mutrata MFG) |
(4) |
15:15-15:40 |
A Study on Sn-whisker growth by thermal cycle |
Sadanori Itou (Itoken office) |
(5) |
15:40-16:05 |
Bayesian Reliability Analysis for Software Debugging Processes Based on Remaining Errors |
Toru Kaise (Univ. of Hyogo) |
(6) |
16:05-16:30 |
Issues and Perspectives of Dependable LSI Design |
Koichiro Takayama, Akira Asato (Fujitsu) |