Fri, Jan 23 PM
13:30 - 17:05 |
| |
13:30-13:35 |
Opening Address ( 5 min. ) |
| (1) |
13:35-14:15 |
[Invited Talk]
High Density Optical Interconnection Technologies for Large Capacity Infomation Processing Equipments |
Yasunobu Matsuoka, Takuma Ban, Reiko Mita, Toshiki Sugawara (Hitachi Ltd.,) |
| (2) |
14:15-14:40 |
High Density Multi-Fiber Connector for Optical Interconnection |
Naoya Nishimura, Katsuki Suematsu, Masao Shinoda, Masato Shiino (The Furukawa Electric Co. Ltd.,) |
| (3) |
14:40-15:05 |
16-fiber Type SF connector for on-board optical wiring |
Ryo Nagase, Shuichiro Asakawa (NTT), Masaru Kobayashi (NTT-AT), Yoshiteru Abe (NTT) |
| |
15:05-15:20 |
Break ( 15 min. ) |
| (4) |
15:20-15:45 |
Degradation phenomenon of electrical contacts by hammering oscillating mechanism
-- for Contact Resistance (III) -- |
Shin-ichi Wada, Taketo Sonoda, Keiji Koshida, Mitsuo Kikuchi, Hiroaki Kubota (TMC System Co., Ltd.,), Koichiro Sawa (Keio Univ.) |
| (5) |
15:45-16:10 |
Synthesis of electroconductive diamond film for application as electrical contact |
Toshiki Tsubota, Tomoo Hamayama, Naoya Murakami, Teruhisa Ohno (Kyushu Inst. of Tech.), Tomoko Suenaga (Kumamoto Ind Res Inst.), Hiroyuki Nagahata (Sanyu Switch Co., Ltd.) |
| (6) |
16:10-16:35 |
A Study of Solder Connection Reliability in Cooling Design for Outdoor Telecommunications Equipment |
Nobuhiro Tamayama, Shinya Hamagishi, Seiji Asai, Takeshi Tajiri, Osamu Kamimura (Hitachi Com Tech, Ltd.) |
| (7) |
16:35-17:00 |
Manufacturing Technology for Embedded LSI(WLP) Substrates |
Keisuke Okada (NEC Toppan Circuit Solutions. INC.) |
| |
17:00-17:05 |
Closing Address ( 5 min. ) |
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