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Technical Committee on Microwaves (MW) [schedule] [select]
Chair Kazuhiko Honjo (Univ. of Electro-Comm.)
Vice Chair Takashi Ohira (Toyohashi Univ. of Tech.), Futoshi Kuroki (Kure National College of Tech.)
Secretary Kazuo Kawabata (Fujitsu Labs.), Kenjiro Nishikawa (NTT)
Assistant Kei Sato (NTT DoCoMo), Koji Shibata (Hachinohe Inst. of Tech.)

Technical Committee on Electron Device (ED) [schedule] [select]
Chair Tamotsu Hashidume (Hokkaido Univ.)
Vice Chair Tetsu Kachi (Toyota Central R&D Labs.)
Secretary Naoki Hara (Fujitsu Labs.), Kunio Tsuda (Toshiba)
Assistant Michihiko Suhara (Tokyo Metropolitan Univ.), Tetsuzo Ueda (Panasonic)

Conference Date Thu, Jan 13, 2011 13:30 - 16:55
Fri, Jan 14, 2011 09:30 - 15:20
Topics Compound Semiconductor IC and High-Speed, High-Frequency Devices/Microwave Technologies 
Conference Place  

Thu, Jan 13 PM 
13:30 - 16:55
(1) 13:30-13:55 The 5.8GHz Receiving and Rectenna Array for Wireless Communication and Power Transmission Masakazu Hori, Kosuke Isono, Hirofumi Noji, Yasuhiro Shibuya (TUS), Shigeo Kawasaki (JAXA)
(2) 13:55-14:20 A Study on GaAs-HBT MMIC couplers with feedback circuit techniques Kazuya Yamamoto, Hitoshi Kurusu, Miyo Miyashita, Satoshi Suzuki, Akira Inoue (Mitsubishi Electric)
(3) 14:20-14:45 Broadside Couplers using Offset-Coupled Lines with Adjacent Ground Through Holes in Multi-layered Substrate Takeshi Yuasa, Yukihiro Tahara, Tetsu Owada, Naofumi Yoneda (Mitsubishi Electric Corp.)
  14:45-15:00 Break ( 15 min. )
(4) 15:00-15:25 Power Absorption Characteristics for Uniform Microwave Heating of Medium with High Conductivities Yuki Nakajima, Suguru Imai, Kenji Taguchi, Tatsuya Kashiwa (Kitami Inst. of Tech.), Toshihide Kitazawa (Ritsumeikan Univ.), Masahiro Suzuki, Kan-ichi Fujii (JAEA)
(5) 15:25-15:50 Broadband High Efficiency Class-E GaN HEMT Amplifier Koji Yamanaka, Norihiro Yunoue, Shin Chaki, Masatoshi Nakayama, Yoshihito Hirano (Mitsubishi Electric)
  15:50-16:05 Break ( 15 min. )
(6) 16:05-16:30 A High-Speed Digital-to-Analog Converter with InP HBT Technology for Multi-Level Optical Transmission Systems Munehiko Nagatani, Hideyuki Nosaka, Shogo Yamanaka, Kimikazu Sano, Koichi Murata (NTT)
(7) 16:30-16:55 32-GHz Phase Shifter IC with 810° control range Hideyuki Nosaka, Munehiko Nagatani, Kimikazu Sano, Koichi Murata (NTT)
Fri, Jan 14  
09:30 - 15:20
(8) 09:30-09:55 Current collapse characterization of AlGaN/GaN HEMTs using by dual-gate structure Masafumi Tajima, Tamotsu Hashizume (Hokkaido Univ.)
(9) 09:55-10:20 Two-Dimensional Analysis of Backside-Electrode and Gate-Field-Plate Effects on Buffer-Related Current Collapse in AlGaN/GaN HEMTs Hiraku Onodera, Atsushi Nakajima, Kazushige Horio (Shibaura Inst. Tech.)
  10:20-10:35 Break ( 15 min. )
(10) 10:35-11:00 Boosting of Blocking Voltages in GaN Transistors by Widening Depletion Layer in Si Substrate Hidekazu Umeda, Asamira Suzuki, Yoshiharu Anda, Masahiro Ishida, Tetsuzo Ueda, Tsuyoshi Tanaka, Daisuke Ueda (Panasonic Co.)
(11) 11:00-11:25 AlGaN/GaN HFETs using highly C-doped layers on Si substrate Takuya Kokawa, Syusuke Kaya, Nariaki Ikeda, Sadahiro Kato (APD)
(12) 11:25-11:50 Developing GaN HEMTs for Ka-Band with 20W Keiichi Matsushita, Hiroyuki Sakurai, Yasushi Kashiwabara, Kazutoshi Masuda, Ken Onodera, Hisao Kawasaki, Kazutaka Takagi, Yoshiharu Takada, Kunio Tsuda (Toshiba)
  11:50-13:00 Lunch Break ( 70 min. )
(13) 13:00-13:25 Process dependence of MOS gate dielectric films on 3C-SiC-OI Keisuke Yokoyama, Hiroyuki Nakamura, Motoi Nakao, Katsunori Onishi (KIT)
(14) 13:25-13:50 III-V quantum well channel MOSFET with back electrode Toru Kanazawa, Ryousuke Terao, Yutaro Yamaguchi, Shunsuke Ikeda, Yoshiharu Yonai, Atsushi Kato, Yasuyuki Miyamoto (Tokyo Tech)
(15) 13:50-14:15 New Stacked Metal-Insulator-Metal Capacitor for future InP-based ICs Applications Takuya Tsutsumi, Suehiro Sugitani, Kazumi Nishimura, Minoru Ida (NTT)
  14:15-14:30 Break ( 15 min. )
(16) 14:30-14:55 A low 1/f Noise and High Reliability InP/GaAsSb DHBT for 76 GHz Automotive Radars Ko Kanaya, Hirotaka Amasuga, Shinsuke Watanabe, Yoshitsugu Yamamoto, Naoki Kosaka, Shinichi Miyakuni, Seiki Goto, Akihiro Shima (Mitsubishi Electric)
(17) 14:55-15:20 A Wafer-Level-Chip-Size-Package Technique with Inverted Microstrip Lines for mm-wave Si CMOS ICs Yasufumi Kawai, Shinji Ujita, Takeshi Fukuda, Hiroyuki Sakai, Tetsuzo Ueda, Tsuyoshi Tanaka (Panasonic)

Announcement for Speakers
General TalkEach speech will have 20 minutes for presentation and 5 minutes for discussion.

Contact Address and Latest Schedule Information
MW Technical Committee on Microwaves (MW)   [Latest Schedule]
Contact Address Kei Satoh (NTT DOCOMO,INC.)
TEL:+81-46-840-6230
FAX:+81-46-840-3789
E--mail:i
or Kazuo Kawabata(Fujitsu Laboratories Ltd.)
E--mail:KabaKao 
ED Technical Committee on Electron Device (ED)   [Latest Schedule]
Contact Address Hara Naoki (Fujitsu Lab.)
TEL : +81-46-250-8242、FAX : +81-46-250-8168
E--mail : o
Kunio Tsuda(Toshiba)
TEL : +81-44-549-2142、FAX : +81-44-520-1501
E--mail : oba
Michihiko Suhara (Tokyo Metropolitan Univ.)
TEL : +81-42-677-2765 Fax : +81-42-677-2756
E--mail : t
Tetsuzo Ueda(Panasonic)
TEL:+81-75-956-8273、FAX:+81-75-956-9110
E--mailzopac 


Last modified: 2010-11-17 13:18:53


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