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=============================================== Technical Committee on Silicon Device and Materials (SDM) Chair: Takahiro Shinada (Tohoku Univ.) Vice Chair: Hiroshige Hirano (TowerJazz Panasonic) Secretary: Hiroya Ikeda (Shizuoka Univ.), Tetsu Morooka (TOSHIBA MEMORY) Assistant: Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.) DATE: Thu, Feb 7, 2019 10:00 - 16:55 PLACE: TOPICS: Backend / Assembly and Related materials technology ---------------------------------------- Thu, Feb 7 No. 42 (10:00 - 16:55) ---------------------------------------- ----- Opening Address ( 5 min. ) ----- (1) 10:05 - 10:45 [Invited Talk] High-precision Dual Damascene Fabrication Technique Takashi Hayakawa, Makoto, Syuji Nozawa, Tatsuya Yamaguchi (TEL) (2) 10:45 - 11:25 [Invited Talk] Half pitch 14 nm direct pattering with Nanoimprint lithography Tetsuro Nakasugi (Toshiba Memory) (3) 11:25 - 12:05 [Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) ----- Lunch Break ( 65 min. ) ----- (4) 13:10 - 13:50 [Invited Talk] Stress Investigation of Annular-Trench-Isolated (ATI) Through Silicon Via (TSV) Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi (AIST) (5) 13:50 - 14:30 [Invited Talk] Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections Yifan Luo, Yutaro Nakoshi, Ryota Mizuno, Ken Suzuki, Hideo Miura (Tohoku Univ.) (6) 14:30 - 15:10 [Invited Talk] Single Crystal Al Interconnects formed on p-GaN and their Application to GaN FET Takeshi Harada, Koji Utaka, Yusuke Kand, Katsuhiko Onishi, Keiichi Matsunaga, Masahiro Hikita, Yasuhiro Uemoto (Panasonic) ----- Break ( 20 min. ) ----- (7) 15:30 - 16:10 [Invited Talk] New contact material for advanced CMOS: cluster-preforming-deposited amorphous Si-rich W silicide film Naoya Okada, Noriyuki Uchida, Shinichi Ogawa, Toshihiko Kanayama (AIST) (8) 16:10 - 16:50 [Invited Talk] Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi (AIST) ----- Closing Address ( 5 min. ) ----- # Information for speakers Invited Talk will have 35 minutes for presentation and 5 minutes for discussion. # CONFERENCE SPONSORS: - This conference is co-sponsored by The Japan Society of Applied Physics. === Technical Committee on Silicon Device and Materials (SDM) === # FUTURE SCHEDULE: Thu, Apr 25, 2019 - Sat, Apr 27, 2019: Yakushima Environmental and Culture Village Center [Sun, Feb 17], Topics: Organic molecular devices, silicon device, biotechnology, thin film device, novel material, evaluation et al. Thu, May 16, 2019 - Fri, May 17, 2019 (tentative): Shizuoka Univ. (Hamamatsu) [Wed, Mar 13], Topics: Materials, Fabrication, and Characterization of Functional Devices, and Related Technology # SECRETARY: Tetsu Morooka(Toshiba Memory Corp.) Tel 059-390-7451 Fax 059-361-2739 E-mail:          ba Last modified: 2018-12-18 16:46:36 |
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