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| Chair |
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Takahiro Shinada (Tohoku Univ.) |
| Vice Chair |
|
Hiroshige Hirano (TowerJazz Panasonic) |
| Secretary |
|
Hiroya Ikeda (Shizuoka Univ.), Tetsu Morooka (TOSHIBA MEMORY) |
| Assistant |
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Takahiro Mori (AIST), Nobuaki Kobayashi (Nihon Univ.) |
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| Conference Date |
Thu, Feb 7, 2019 10:00 - 16:55 |
| Topics |
Backend / Assembly and Related materials technology |
| Conference Place |
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| Sponsors |
This conference is co-sponsored by The Japan Society of Applied Physics.
|
Copyright
and
reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
| Registration Fee |
This workshop will be held as the IEICE workshop in fully electronic publishing. Registration fee will be necessary except the speakers and participants other than the participants to workshop(s) in non-electronic publishing. See the registration fee page. We request the registration fee or presentation fee to participants who will attend the workshop(s) on SDM. |
Thu, Feb 7 No. 42
10:00 - 16:55 |
| |
10:00-10:05 |
Opening Address ( 5 min. ) |
| (1) |
10:05-10:45 |
[Invited Talk]
High-precision Dual Damascene Fabrication Technique |
Takashi Hayakawa, Makoto, Syuji Nozawa, Tatsuya Yamaguchi (TEL) |
| (2) |
10:45-11:25 |
[Invited Talk]
Half pitch 14 nm direct pattering with Nanoimprint lithography  SDM2018-91 |
Tetsuro Nakasugi (Toshiba Memory) |
| (3) |
11:25-12:05 |
[Invited Talk]
Ultrafine 3D Interconnect Technology Using Directed Self-Assembly SDM2018-92 |
Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) |
| |
12:05-13:10 |
Lunch Break ( 65 min. ) |
| (4) |
13:10-13:50 |
[Invited Talk]
Stress Investigation of Annular-Trench-Isolated (ATI) Through Silicon Via (TSV) SDM2018-93 |
Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi (AIST) |
| (5) |
13:50-14:30 |
[Invited Talk]
Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections SDM2018-94 |
Yifan Luo, Yutaro Nakoshi, Ryota Mizuno, Ken Suzuki, Hideo Miura (Tohoku Univ.) |
| (6) |
14:30-15:10 |
[Invited Talk]
Single Crystal Al Interconnects formed on p-GaN and their Application to GaN FET SDM2018-95 |
Takeshi Harada, Koji Utaka, Yusuke Kand, Katsuhiko Onishi, Keiichi Matsunaga, Masahiro Hikita, Yasuhiro Uemoto (Panasonic) |
| |
15:10-15:30 |
Break ( 20 min. ) |
| (7) |
15:30-16:10 |
[Invited Talk]
New contact material for advanced CMOS: cluster-preforming-deposited amorphous Si-rich W silicide film SDM2018-96 |
Naoya Okada, Noriyuki Uchida, Shinichi Ogawa, Toshihiko Kanayama (AIST) |
| (8) |
16:10-16:50 |
[Invited Talk]
Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air SDM2018-97 |
Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi (AIST) |
| |
16:50-16:55 |
Closing Address ( 5 min. ) |
| Announcement for Speakers |
| Invited Talk | Each speech will have 35 minutes for presentation and 5 minutes for discussion. |
| Contact Address and Latest Schedule Information |
| SDM |
Technical Committee on Silicon Device and Materials (SDM) [Latest Schedule]
|
| Contact Address |
Tetsu Morooka(Toshiba Memory Corp.)
Tel 059-390-7451 Fax 059-361-2739
E- :          ba |
Last modified: 2018-12-18 16:46:36
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