Thu, Jan 17 AM 09:15 - 16:35 |
(1) |
09:15-09:40 |
Non-Contact 10% Efficient 36mW Power Delivery Using On-Chip Inductor in 0.18-um CMOS |
Yuan Yuxiang, Yoichi Yoshida, Tadahiro Kuroda (keio Univ.) |
(2) |
09:40-10:05 |
Integrated evaluation of on-chip power supply noise and off-chip electromagnetic noise on digital LSI |
Yuki Takahashi (Kobe Univ.), Kouji Ichikawa (Denso), Makoto Nagata (Kobe Univ.) |
(3) |
10:05-10:30 |
ptimization of Active Substrate Noise Cancellng Technique Using Multi di/dt Detectors |
Toru Nakura, Taisuke Kazama, Makoto Ikeda, Kunihiro Asada (The Univ. of Tokyo) |
|
10:30-10:45 |
Break ( 15 min. ) |
(4) |
10:45-11:10 |
All Digital Gated Oscillator for Dynamic Supply Noise Measurement |
Yasuhiro Ogasahara, Masanori Hashimoto, Takao Onoye (Osaka Univ.) |
(5) |
11:10-11:35 |
Design of an On-Chip Noise Canceller with High Voltage Supply Lines for Nanosecond-Range Power Supply Noise |
Yasumi Nakamura, Makoto Takamiya, Takayasu Sakurai (Univ. of Tokyo) |
(6) |
11:35-12:00 |
LSI and PCB Unified Noise Analysis CAD System |
Toshiro Sato, Hiroyuki Orihara, Shogo Fujimori, Masaki Tosaka (FATEC) |
|
12:00-13:00 |
Break ( 60 min. ) |
(7) |
13:00-13:40 |
[Special Invited Talk]
On-chip monitors and power-supply integrity |
Makoto Nagata (Kobe Univ.) |
(8) |
13:40-14:20 |
[Special Invited Talk]
Techniques for power supply noise management in the SX supercomputers |
Jun Inasaka, Mikihiro Kajita (NEC Corp.) |
|
14:20-14:30 |
Break ( 10 min. ) |
(9) |
14:30-15:10 |
[Special Invited Talk]
In-situ measurement of supply-noise maps with millivolt accuracy and nanosecond-order time resolution |
Yusuke Kanno, Yuki Kondoh (HCRL), Takahiro Irita, Kenji Hirose, Ryo Mori, Yoshihiko Yasu (Renesas Technology, Corp.), Shigenobu Komatsu, Hiroyuki Mizuno (HCRL) |
|
15:10-15:25 |
Break ( 15 min. ) |
(10) |
15:25-16:35 |
|
Fri, Jan 18 AM 09:40 - 16:35 |
(11) |
09:40-10:05 |
Arithmetic operation circuit based on abacus architecture |
Syunsuke Nagasawa, Shugang Wei (Gunma Univ) |
(12) |
10:05-10:30 |
A compact RF signal quality measurement macro for RF test and diagnosis |
Koichi Nose, Masayuki Mizuno (NEC) |
(13) |
10:30-10:55 |
A Method for Measuring Vref Noise Tolerance of DDR2-SDRAM on Test Board that Simulates Memory Module |
Yutaka Uematsu, Hideki Osaka (Hitachi), Yoji Nishio, Susumu Hatano (Elpida) |
|
10:55-11:10 |
Break ( 15 min. ) |
(14) |
11:10-12:00 |
[Tutorial Lecture]
Survey of Analysis Techniques for On-chip Power Distribution Networks |
Takashi Sato (Tokyo Tech.) |
|
12:00-13:00 |
Lunch Break ( 60 min. ) |
(15) |
13:00-13:25 |
Study on Low Stress Condition of Pseudo-SOC Integration Using Stress Analysis |
Yutaka Onozuka, Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya, Hideyuki Funaki (Toshiba R & D Center) |
(16) |
13:25-13:50 |
An Extraction Method of Material Constants by Transmission Line Measurements |
Hiroshi Toyao, Yoshiaki Wakabayashi (NEC) |
(17) |
13:50-14:15 |
A Package-on-Package using Coreless Substrate with Excellent Power Integrity |
Kentaro Mori, Jun Sakai, Katsumi Kikuchi, Shinji Watanabe, Tomoo Murakami, Shintaro Yamamichi (NEC) |
(18) |
14:15-14:40 |
Assessment Test for Solder Joint Reliability in Mobile Products |
Masazumi Amagai, Hiroyuki Sano (TI Japan) |
|
14:40-14:55 |
Break ( 15 min. ) |
(19) |
14:55-15:20 |
Chip Thinning Technologies Realizing High Chip Strength |
Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu, Susumu Harada (Toshiba Co.) |
(20) |
15:20-15:45 |
A multi-layer wafer-level 5-um-thick Cu wiring technology with photosensitive resin |
Katsumi Kikuchi (NEC), Kouji Soejima (NECEL), Yasuhiro Ishii (NEC), Masaya Kawano (NECEL), Masayuki Mizuno, Shintaro Yamamichi (NEC) |
(21) |
15:45-16:10 |
A method of Ultra-fine Pad Interconnection using Electroless Deposition |
Tokihiko Yokoshima, Yasuhiro Yamaji, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) |
(22) |
16:10-16:35 |
Reliability evaluation of lead free solder joint against vibration load under thermal circumstance |
Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.) |