IEICE Technical Report

Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380

Electromechanical Devices

Workshop Date : 2017-02-17 / Issue Date : 2017-02-10

EMD2016-87
Properties of contact lubricant under high temperature and contact resistance
Terutaka Tamai (Elcontech), Masahiro Yamakawa (TETRA)
pp. 1 - 7

EMD2016-88
The Investigation of Graphene Film as a New Electrical Contact Material
Kikuo Mori, Hajime Takada (YZK), Tetsuo Shimizu, Sumiko Kawabata, Miyuki Tanaka, Toshitaka Kubo (AIST)
pp. 9 - 13

EMD2016-89
Contorol of sliding wear for thin film sliding contacts.
Yuki Yamamoto, Yoshihiro Umeuchi (Omron), Makito Morii (OES)
pp. 15 - 18

EMD2016-90
Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy
Shigeru Sawada (SEI), Song-zhu Kure-chu, Rie Nakagawa, Toru Ogasawara, Hitoshi Yashiro (Iwate Uni.), Yasushi Saitoh (AN-Tech)
pp. 19 - 24

EMD2016-91
Study on micro vibration sensing technique using Fabry-Perot interferometer with optical fibers
Kaoru Kuribayashi, Ryo Nagase (CIT)
pp. 25 - 30

EMD2016-92
Fiber-optic measurement of sap consistency (5)
Masashi Iida, Ryo Nagase (CIT)
pp. 31 - 35

EMD2016-93
(See Japanese page.)
pp. 37 - 43

EMD2016-94
A Study on Breakdown caused by Inorganic Phosphate and the Countermeasures
sadanori ito (itoken)
pp. 45 - 48

EMD2016-95
Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices
Osmau Ohtani, Tomohiro Fukuhara (Omron Corp.)
pp. 49 - 52

EMD2016-96
DC300 V-150 A arcless current interruption by using arcless hybrid DC circuit breaker
Tatsuya Hayakawa, Kyotaro Nakayama, Shungo Zen, Koichi Yasuoka (Titech)
pp. 53 - 58

EMD2016-97
Effect of various resin materials on arc duration under magnetic field
Daisuke Okazaki (OMRON), Masayuki Noda (OMRON Relay and Device)
pp. 59 - 63

EMD2016-98
Report on thermal simulation technique to analyze effect of contact bounce arc.
Kazua Murakami, Takeshi Nishida (Omron), Tetsuo Shinkai (OER)
pp. 65 - 70

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan