A. Active Devices and Circuits

Low-Noise Devices and Circuits, High-Power Devices and Circuits, Control Circuits (MIX, Osc., SW, etc.), MMICs and HMICs (Receivers, Transmitters, etc.), Silicon RF Devices

B. Passive Components

Filters and Resonators, Ferrite and Surface Wave Components, Packaging Techniques, Passive Devices and Circuits, Waveguides and Striplines

C. Systems

Communication Systems, Microwave Applications (ITS, SPS, etc.), Microwave Medical & Biological Applications/EMC/EMI, Phased Array Antenna Systems

D. Basic Theory and Techniques

Scattering and Propagation, Electromagnetic Field Theory and CAD, Antenna Theory, Microwave Antennas, Microwave Photonics, Microwave Superconductivity, Measurement Techniques

E. Emerging Technologies

RF MEMS, Active Antennas, Photonic Bandgap, Software Defined Radio, Wireless LAN and Bluetooth

President	Osamu HASHIMOTO	Aoyama Gakuin University
Vice President	Takashi OHIRA	Toyohashi University of Technology
Secretary	Masatoshi NAKAYAMA	Mitsubishi Electric Corporation
	Atsushi SANADA	Yamaguchi University
Vice Secretary	Yangjun ZHANG	Ryukoku University
	Kei SATOH	NTT DoCoMo
Member	Manabu OHMIYA	Hokkaido University
	Hiroshi OKAZAKI	NTT DoCoMo
	Hiroshi OKABE	Hitachi, Ltd.
	Tatsuya KASHIWA	Kitami Institute of Technology
	Toshihisa KAMEI	National Defence Academy
	Hiroyuki KAYANO	Toshiba Corporation
	Shoichi KITAZAWA	ATR
	Takao KUKI	NHK
	Futoshi KUROKI	Kure National College of Technology
	Kazuhiko KOBAYASHI	Fujitsu
	Noriaki SAITO	Matsushita Electric Industrial Co., Ltd.
	Tomio SATO	Eudyna Devices Inc.
	Naoki SHINOHARA	Kyoto University
	Katsumi SUZUKI
	Koichi TAKAHASHI	Aichi University of Technology
	Takayuki TANAKA	Saga University
	Hiroyuki TODA	Doshisha University
	Masashi NAKATSUGAWA	NTT
	Morshige HIEDA	Mitsubishi Electric Corporation
	Toshiro HIRATSUKA	Murata Co., Ltd.
	Takuichi HIRANO	Tokyo Institute of Technology
	Masafumi FUJII	University of Toyama
	Mayumi MATSUNAGA	Ehime University
	Keren LI	NICT
	Akio WAKEJIMA	NEC