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Chair |
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Tatsuya Kunikiyo (Renesas) |
Vice Chair |
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Takahiro Shinada (Tohoku Univ.) |
Secretary |
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Rihito Kuroda (Tohoku Univ.), Tadashi Yamaguchi (Renesas) |
Assistant |
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Hiroya Ikeda (Shizuoka Univ.), Tetsu Morooka (TOSHIBA MEMORY) |
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Conference Date |
Thu, Feb 8, 2018 10:00 - 16:50 |
Topics |
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Conference Place |
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Sponsors |
This conference is co-sponsored by The Japan Society of Applied Physics.
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10:00-10:05 |
Opening Address ( 5 min. ) |
(1) |
10:05-10:45 |
[Invited Talk]
Cluster-Preforming-Deposited Amorphous WSin (n = 12) Insertion Film of Low SBH and High Diffusion Barrier for Direct Cu Contact |
Naoya Okada, Noriyuki Uchida, Shinichi Ogawa, Kazuhiko Endo, Toshihiko Kanayama (AIST) |
(2) |
10:45-11:25 |
[Invited Talk]
Characteristics of Cobalt alloy for low resistivity contact in sub 10 nm FinFET |
Junichi Koike, Maryamsadat Hosseini, Daisuke Ando, Yuji Sutou (Tohoku Univ.) |
(3) |
11:25-12:05 |
[Invited Talk]
Moisture Barrier Properties of Capping Graphene for Copper Metallization |
Kazuyoshi Ueno, Ploybussara Gomasang, Takumi Abe (SIT), Kenji Kawahara (Kyushu Univ.), Yoko Wasai (Horiba Techno), Nguyen Thanh Cuong (NIMS), Nataliya Nabatova-Gabain (Horiba Techno), Hiroki Ago (Kyushu Univ.), Susumu Okada (Univ. Tsukuba) |
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12:05-13:10 |
Lunch Break ( 65 min. ) |
(4) |
13:10-13:50 |
[Invited Talk]
A Novel Role for SiCN to Suppress H2O Outgas from TEOS oxide films in wafer bonding |
Michinari Tetani, Yasunori Morinaga, Masakazu Hamada, Masahiko Takeuchi, Shinji Uya, Hisashi Yano, Naoaki Sato, Susumu Matsumoto (TPSCo) |
(5) |
13:50-14:30 |
[Invited Talk]
In-situ Analysis of Corrosion inhibitor behavior of Co surface |
Toshiaki Shibta, Tomohiro Kusano, Ken Harada, Kan Takeshita, Yasuhiro Kawase (Mitsubishi Chemical Corp.) |
(6) |
14:30-15:10 |
[Invited Talk]
Low cost solder-TSV technology for automobile application |
Atsushi Mizutani, Yuki Ohara, Yuki Inagaki, Kazushi Asami (DENSO) |
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15:10-15:30 |
Break ( 20 min. ) |
(7) |
15:30-16:10 |
[Invited Talk]
Low temperature Cu-Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn-Bi eutectic powders |
Muhammad Khairi Faiz, Takehiro Yamamoto (Waseda Univ.), Tadatomo Suga (Tokyo Univ.), Tomoyuki Miyashita, Makoto Yoshida (Waseda Univ.) |
(8) |
16:10-16:50 |
[Invited Talk]
Next Generation Circuit Fabrication by Molecular Bonding Technology |
Akihiko Happoya (Toshiba), Kunio Mori (SCL) |
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16:50-16:55 |
Closing Address ( 5 min. ) |
Announcement for Speakers |
Invited Talk | Each speech will have 30 minutes for presentation and 10 minutes for discussion. |
Contact Address and Latest Schedule Information |
SDM |
Technical Committee on Silicon Device and Materials (SDM) [Latest Schedule]
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Contact Address |
Rihito Kuroda(Tohoku Univ.)
Tel 022-795-4833 Fax 022-795-4834
E-: e3 |
Last modified: 2018-01-19 15:04:08
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