- Jun. 15, 2022
First CFP of IEICE Transactions- Jun. 15, 2022
- Announcement of ICEC 2024
- May 30, 2022
- Final Program has been released.
- Apr. 28, 2022
- Invitation to Exhibition has been released.
- Apr. 28, 2022
- The Advance Program has been released.
- Mar. 24, 2022
- Registration has started.
- Dec. 7, 2021
- Paper Submission has started.
- Nov. 11, 2021
- Abstract Submission Deadline is extended to 30th November, as Second Round Submission.
Please click here to submission. - Oct. 30, 2021
- Abstract Submission Deadline is extended to 10th November!
Please click here to submission. - Oct. 1, 2021
- Start of Abstract Submission on the Web Site
Please click here to submission. - Sep. 1, 2021
- Abstract Submission: Coming Soon!
- June 7, 2021
- 1st CFP is available.
Please click here to download.
General Information
The "31st International Conference on Electrical Contacts" (ICEC 2022 Sapporo) will be held from June 13 to 16, 2022. Conference style is decided to be hybrid. This conference series has a long history. We would like to invite all engaged in research and development in the various fields of electrical contact to participate in this conference.
ICEC 2022 Sapporo is sponsored by The Institute of Electronics, Information and Communication Engineers, Electronics Societty (IEICE-ES).
Call for Papers (IEICE Transactions)
The Special Section on “Recent Development of Electro-Mechanical Devices” on Transactions on Electronics will be published on December 2023. For this Special Section, all authors in the related fields are prompted to submit their papers.
The topics of interests include the followings, but not limited to:- Devices & Components
- Materials
- Technologies
- Applications
- Micro Electromechanical Systems, Relay & Switch, Electrical & Optical Connector, Human Interface Devices, Electromechanical Transducers and Sensors, Actuator & Small Motor, Arrester & Fuse.
- Contact, Spring, Molding, and Other Materials Related to the Electromechanical Devices.
- Electrical Contact, Arc Discharge Phenomena, Tribology, Connection & Inter-connection, Plating, Molding, Metal Machining, Device Mounting & Packaging, Board & Substrate, Optoelectronics, Packaging, and Other Related Technologies.
- Compatible Design with Environment, RF-communication and EMC, Pb-Free and Cd-Free Technologies, Recycle Re-use, and Reduce Technologies.
Submission Instructions
- The deadline for submission is December 15, 2022.
- This special section will accept only PAPERs and BRIEF PAPERs submitted through electronic submission procedure.
- A PAPER and a BRIEF PAPER should be within 8 and 4 printed pages, respectively.
- Manuscript should be prepared according to the guideline in the “Information for Authors”
- IEICE Website for submitting a paper: coming soon!
Inquiries:
If you have any questions or anything unclear, please contact the following:Yoshiki Kayano
The University of Electro-Communications
Contact to : ykayano [at] uec.ac.jp
Announcement of ICEC 2024
- October 6 to 10, 2024
- Annapolis, Maryland, USA
- October 1, 2021 (Fri.)
- Start of Abstract Submission on the Web Site
October 31, 2021 (Sun.)Abstract Submission DeadlineNovember 30, 2021 (Tue.)Abstract Submission Deadline (Deadline is extended to 30th November, as Second Round Submission.)- November 15, 2021 (Mon.)
- Abstract Acceptance Notification
January 15, 2022 (Sat.)Paper Submission Deadline- Early March
- Review comments to the authors
April 10, 2022 (Sun.)Revised Paper Submission Deadline- April 14, 2022 (Thu.)
- Paper Acceptance Notification