Summary
International Symposium on Antennas and Propagation
2013
Session Number:TP-1(B)
Session:
Number:TP-1(B)-2
A New E-plane Bend for SIW Circuits and Antennas Using Gapwave Technology
Jian Yang, Ali Razavi Parizi,
pp.-
Publication Date:2013/10/22
Online ISSN:2188-5079
DOI:10.34385/proc.54.TP-1(B)-2
Summary:
The SIW (substrate integrated waveguide) technology makes use of metal vias in a dielectric substrate, electrically connecting two parallel metal plates, to make a waveguide. The main advantages of SIW are simple geometry, low manufacture cost and integratability with MMIC (monolithic microwave integrated circuit) or other circuits. It is often required to have E-plane bend components in the whole SIW circuits or antenna systems for the integration, for example, in multilayer configurations. However, it is difficult to make an E-plane bend by using only SIW technology. We present a new solution to E-plane bend for SIW circuits and antennas by combining the SIW technology and the so-called gap waveguide (or gapwave) technology in the paper, with the latter also realized in PCB (printed circuit board) technology, and therefore keeping its above-mentioned advantages.