Summary
International Symposium on Antennas and Propagation
2010
Session Number:3TC3
Session:
Number:3TC3-1
Size Reduction of the Waveguide Feed Circuit for a Millimeter-Wave Dipole Antenna on a Thick Resin Layer on the Back Side of a Silicon Chip at 60GHz
Tomoya Suzuki, Jiro Hirokawa, Yasutake Hirachi, Makoto Ando,
pp.-
Publication Date:2010/11/23
Online ISSN:2188-5079
Summary:
Recently, there are many discussions on integration of an antenna on a 60 GHz silicon CMOS chip. When the antenna is integrated on the same layer of a RF circuit, the radiation efficiency is quite low due to the small height (typically 10 mm) of the RF circuit layer. When the antenna is integrated separately from the chip, the connecting loss is quite large (typically 2 dB). We proposed the configuration where an antenna is integrated on a thick resin layer on the opposite side of a RF circuit layer by feeding through a hole as shown in Fig.1 [1]. The thick resin layer can make the radiation efficiency larger and the connection loss can be small. We designed a dipole antenna on a 200 mm -thick resin layer on the back side of a 5 mm square silicon chip at 60 GHz. The hole size was 2.0 mm by 1.0 mm, which was large in comparison with the size of the silicon chip. This paper proposes the size reduction of the feed circuit by decreasing the post diameter as well as the hole in the silicon chip.