Summary
International Symposium on Antennas and Propagation
2013
Session Number:FA-1(D)
Session:
Number:FA-1(D)-2
Transmission Characteristics of Via Holes in High-Speed PCB
He Xiangyang, Lei Zhenya, Wang Qing,
pp.-
Publication Date:2013/10/22
Online ISSN:2188-5079
DOI:10.34385/proc.54.FA-1(D)-2
Summary:
A method of analyzing transmission characteristics of via holes in the time domain is presented in this paper. A suitable analysis model is set up using CST (Computer Simulation Technology). With theoretical analysis, the effect of via structures on signal transmission characteristics could be acquired. The simulation results show that appropriate design for via holes can reduce transmission characteristics issues effectively.