Summary

International Symposium on Electromagnetic Compatibility

2009

Session Number:21Q3

Session:

Number:21Q3-2

Multi-Port Test for Quasi-Static Lumped Element Stand-Alone Model

U. Paoletti,  

pp.145-148

Publication Date:2009/7/20

Online ISSN:2188-5079

DOI:10.34385/proc.14.21Q3-2

PDF download (232.4KB)

Summary:
The stand-alone package modeling scheme is aimed at estimating the high frequency electromagnetic coupling between a package and some external structures, such as printed circuit board (PCB) traces and power/ground planes, or other stacked packages, by limiting at the same time the disclosure of internal details of the package itself. The package is at first modeled in stand-alone conditions, that is without any PCB, by using all the detailed information. In the second stage the interaction with a particular PCB is taken into account with a simplified model, which can be open to the public and also reduces the complexity of the calculation. Several types of stand-alone models are possible. The quasi-static lumped element stand-alone model is one of the possible implementation of this modeling scheme. It has the advantage that the magnetic and electric fields are treated separately, but it has a limited bandwidth. In the present paper this model is used to estimate the interaction of a scaled quad flat package model with two PCBs having different configurations. The results are compared with the measurement results obtained with a 4-port network analyzer, and show an interesting agreement even though the model has been obtained with very simple expressions.