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2019 Joint International Symposium on Electromagnetic Compatibility and Asia-Pacific International Symposium on Electromagnetic Compatibility, Sapporo
| number | title/author |
|---|---|
| WedAM2B.1 | Classification of an Embedded System Instruction EMI Using a Deep Convolutional Neural Network Shih-Yi Yuan, Po-Yen Lin, Cheng-You Chang, Jian-Li Dong, Chia-Hung Su, |
| WedAM2B.2 | Design Technique on Reduction of Power Cross Regulation and Coupling in Data Center Microprocessor Power Patt Chang, Yuan Liang Li, Falconee Lee, |
| WedAM2B.3 | Modeling and Analysis of Multiple Coupled Through-Silicon Vias (TSVs) for 2.5-D/3-D ICs Kyungjun Cho, Youngwoo Kim, Junyong Park, Hyesoo Kim, Seongguk Kim, Subin Kim, Gapyeol Park, Kyungjune Son, Joungho Kim, |
| WedAM2B.4 | Modeling and Analysis for MOS Capacitance of TSV Considering Temperature Dependence Qiu Min, Er-Ping Li, Jian-Ming Jin, |
| WedAM2B.5 | PEEC Modeling and Model Order Reduction of Magnetically Enhanced Planar Inductive Device Huazhao Wu, Junping He, |