2019 Joint International Symposium on Electromagnetic Compatibility and Asia-Pacific International Symposium on Electromagnetic Compatibility, Sapporo

number title/author
WedAM1B.1Frequency-Domain Characterization and Modelling of a Multi-Layer Ceramic Capacitor for RF Applications
Hrvoje Stimac, Raul Blecic, Renaud Gillon, Adrijan Baric,
WedAM1B.2Study on Temperature Impact of the Dielectric Material Loss for AiP Application
Hung-Chun Kuo, Ming-Fong Jhong, Chen-Chao Wang,
WedAM1B.3Electrical Performance Comparison between Coaxial and Non-Coaxial Silicone Rubber Socket
Junyong Park, Taein Shin, Seongguk Kim, Hyunwook Park, Daehwan Lho, Kyungjun Cho, Hyesoo Kim, Joungho Kim,
WedAM1B.4Eye Diagram Prediction for Input/output Buffer Information Specification-Algorithmic Modeling Interface (IBIS-AMI)
Junyong Park, Seongguk Kim, Taein Shin, Daehwan Lho, Hyunwook Park, Gapyeol Park, Joungho Kim,
WedAM1B.5Jitter Estimation in a CMOS Tapered Buffer for an Application of Clock Distribution Network
Muhammed Suhail Illikkal, Jai Narayan Tripathiy, Hitesh Shrimali,