number | title/author |
---|---|
TuePM1B.1 | Study of TDR Impedance for Better Analysis to Measurement Correlation (I) Yuandong Guo, Bichen Chen, Xinglin Sun, Xiaoning Ye, Jimmy Hsu, Jun Fan, |
TuePM1B.2 | Advanced PCB Lamination Material Development for High-Speed Networking Application (I) Yuki Hirokawa, Tatsuya Arisawa, Shohei Hanazaki, Mitsuyoshi Nishino, Tomoyuki Abe, |
TuePM1B.3 | Characterization of Insertion Loss of Striplines on Various Substrate Materials As a Function of Temperature (I) Jimmy Hsu, Chong-Jin Ong, Xiaoning Ye, |
TuePM1B.4 | Copper Treatment Investigation on High Frequency PCB Electrical Characteristics (I) ShengChieh Lin, Jimmy Hsu, |