2019 Joint International Symposium on Electromagnetic Compatibility and Asia-Pacific International Symposium on Electromagnetic Compatibility, Sapporo

number title/author
TuePM1B.1Study of TDR Impedance for Better Analysis to Measurement Correlation (I)
Yuandong Guo, Bichen Chen, Xinglin Sun, Xiaoning Ye, Jimmy Hsu, Jun Fan,
TuePM1B.2Advanced PCB Lamination Material Development for High-Speed Networking Application (I)
Yuki Hirokawa, Tatsuya Arisawa, Shohei Hanazaki, Mitsuyoshi Nishino, Tomoyuki Abe,
TuePM1B.3Characterization of Insertion Loss of Striplines on Various Substrate Materials As a Function of Temperature (I)
Jimmy Hsu, Chong-Jin Ong, Xiaoning Ye,
TuePM1B.4Copper Treatment Investigation on High Frequency PCB Electrical Characteristics (I)
ShengChieh Lin, Jimmy Hsu,