number | title/author |
---|---|
3A4-1 | A comparison between radiation and ohmic losses in highly-conducting interconnects for high-speed applications A. Maffucci, G. Miano, |
3A4-2 | Transient analysis of differential interconnects by SPICE- like circuits accounting for frequency-dependent losses R. Araneo, |
3A4-3 | RF EM susceptibility analysis of high-speed circuits using MOM combining with circuit-based method W. Yuan, |
3A4-4 | Distributed modeling of on-chip power distribution networks using conformal mapping and FDTD method J. Mao, M. Swaminathan, J. Libous, |