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2004 International Symposium on Electromagnetic Compatibility
| number | title/author |
|---|---|
| 3A1-1 | Microelectronic EMC system design for high density interconnect and high frequency environment W. John, |
| 3A1-2 | Three-wire analysis model to predict SI and EMC effects E. Engin, |
| 3A1-3 | Radiation mechanisms for semiconductor devices and packages T. Hubing, |
| 3A1-4 | EMC macro-model (LECCS-core) for multiple power- supply pin LSI K. Nakamura, |
| 3A1-5 | EMC macro-model with I/O ( LECCS-I/O) for multi-bit drives H. Osaka, |