number | title/author |
---|---|
14P2-B1 | In-Stack Monitoring of Signal and Power Nodes in Three Dimensional Integrated Circuits Yuuki Araga, Ranto Miura, Nao Ueda, Noriyuki Miura, Makoto Nagata, |
14P2-B2 | SI/PI Co-simulation including Voltage Regulating Circuitry for High-Performance Multi-Chip Package JuHwan Lim, JongJoo Lee, SoYoung Jung, |
14P2-B3 | Measurement and Analysis of Wireless Power Distribution Network using Magnetic Field Resonance in 3D Package and IC Eunseok Song, Daniel H. Jung, Youngwoo Kim, Joungho Kim, |
14P2-B4 | Crosstalk Rudction in TSV Arrays with Direct Ohmic Contact between Metal and Silicon-substrate Decao Yang, Er-Ping Li, Jun Li, Xingchang Wei, Jianyong Xie, M. Swaminathan, |
14P2-B5 | Design of Compact and Low-EMI Waveguide Structures based on Through Glass Vias Xing Chang Wei, Xiao Juan Wang, De Cao Yang, Jun Li, Xin Wei, |
14P2-B6 | Designing Test Patterns for Effective Measurement of Typical TSV Pairs in a Silicon Interposer Qian Wang, Ketan Shringarpure, Jun Fan, Chulsoon Hwang, Siming Pan, |