2014 International Symposium on Electromagnetic Compatibility, Tokyo

number title/author
14P2-B1In-Stack Monitoring of Signal and Power Nodes in Three Dimensional Integrated Circuits
Yuuki Araga, Ranto Miura, Nao Ueda, Noriyuki Miura, Makoto Nagata,
14P2-B2SI/PI Co-simulation including Voltage Regulating Circuitry for High-Performance Multi-Chip Package
JuHwan Lim, JongJoo Lee, SoYoung Jung,
14P2-B3Measurement and Analysis of Wireless Power Distribution Network using Magnetic Field Resonance in 3D Package and IC
Eunseok Song, Daniel H. Jung, Youngwoo Kim, Joungho Kim,
14P2-B4Crosstalk Rudction in TSV Arrays with Direct Ohmic Contact between Metal and Silicon-substrate
Decao Yang, Er-Ping Li, Jun Li, Xingchang Wei, Jianyong Xie, M. Swaminathan,
14P2-B5Design of Compact and Low-EMI Waveguide Structures based on Through Glass Vias
Xing Chang Wei, Xiao Juan Wang, De Cao Yang, Jun Li, Xin Wei,
14P2-B6Designing Test Patterns for Effective Measurement of Typical TSV Pairs in a Silicon Interposer
Qian Wang, Ketan Shringarpure, Jun Fan, Chulsoon Hwang, Siming Pan,