Presentation 2015-03-02
A cut-pattern reduction method for routing in Self-Aligned Double Patterning
Noriyuki TAKAHASHI, Takeshi IHARA, Atsushi TAKAHASHI,
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Abstract(in English) In Self-Aligned Double Patterning (SADP), a routing method that generates a SADP friendly routing pattern efficiently by using two-color base grid was proposed. A routing pattern can be realized without trim mask if a special pattern called cut-pattern is used in a pattern mask of SADP. However the reliability of a wafer image is expected to be reduced if the number of cut-patterns used increases. In this paper, we propose a routing method that realizes a routing pattern with less cut-patterns by using two-color base grid.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Self-Aligned Double Patterning (SADP) / Two-color base grid / Mask / Cut-Pattern
Paper # VLD2014-154
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Committee VLD
Conference Date 2015/2/23(1days)
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Registration To VLSI Design Technologies (VLD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A cut-pattern reduction method for routing in Self-Aligned Double Patterning
Sub Title (in English)
Keyword(1) Self-Aligned Double Patterning (SADP)
Keyword(2) Two-color base grid
Keyword(3) Mask
Keyword(4) Cut-Pattern
1st Author's Name Noriyuki TAKAHASHI
1st Author's Affiliation Department of Computer Science, Tokyo Institute of Technology()
2nd Author's Name Takeshi IHARA
2nd Author's Affiliation Department of Communications and Computer Engineering, Tokyo Institute of Technology
3rd Author's Name Atsushi TAKAHASHI
3rd Author's Affiliation Department of Communications and Computer Engineering, Tokyo Institute of Technology
Date 2015-03-02
Paper # VLD2014-154
Volume (vol) vol.114
Number (no) 476
Page pp.pp.-
#Pages 6
Date of Issue