Presentation 2015-01-29
Temperature sensor applying Body Bias in Silicon-on-Thin-BOX
Tsubasa KOSAKA, Shohei NAKAMURA, Kimiyoshi USAMI,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) The performance advancement by the transistor scaling is blocked by increase of power consumption and process variation. Silicon on Thin BOX(SOTB) solve these problems. In addition, there is a problem that the temperature changes in a transistor. The temperature change causes deterioration and the trouble of the transistor and causes malfunction of the chip. The temperature sensor which measures the temperature in the chip is necessary. In this paper, a temperature sensor for SOTB is proposed. We demonstrate that the temperature sensor for SOTB enables us to achieve high precision of the thermometry and mitigate the process variation at every chip by Body Bias than a conventional bulk transistor.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Silicon-on-Thin-BOX MOSFET / Body Bias / Temperature sensor / Leakage monitor / Process variation
Paper # VLD2014-127,CPSY2014-136,RECONF2014-60
Date of Issue

Conference Information
Committee RECONF
Conference Date 2015/1/22(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Reconfigurable Systems (RECONF)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Temperature sensor applying Body Bias in Silicon-on-Thin-BOX
Sub Title (in English)
Keyword(1) Silicon-on-Thin-BOX MOSFET
Keyword(2) Body Bias
Keyword(3) Temperature sensor
Keyword(4) Leakage monitor
Keyword(5) Process variation
1st Author's Name Tsubasa KOSAKA
1st Author's Affiliation Graduate School of Engineering and Science,Shibaura Institute of Technology()
2nd Author's Name Shohei NAKAMURA
2nd Author's Affiliation Graduate School of Engineering and Science,Shibaura Institute of Technology
3rd Author's Name Kimiyoshi USAMI
3rd Author's Affiliation Department of Information Science and Engineering, Shibaura Institute of Technology
Date 2015-01-29
Paper # VLD2014-127,CPSY2014-136,RECONF2014-60
Volume (vol) vol.114
Number (no) 428
Page pp.pp.-
#Pages 6
Date of Issue