| Presentation | 2015-01-23 A Study of the High-Density Package of the Differential Transmission Line Takashi KUWAHARA, Yoshihiro AKEBOSHI, Seiichi SAITO, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | With improvement in the speed of digital equipment in recent years, the differential signal transmission line is used abundantly in the circuit substrate. However, by using a differential signal transmission line, the number of signal wires doubles as compared with the conventional single-ended, and also the number of high-speed signal wires increases by many lanes which is used in PCI Express, and it has been a subject what density growth of the gap between the inside of a signal wire pair or a pair is packed and carried out. Then, writers examined the cross-sectional shape which can reduce the basis of the conditions that signal conductor section area and signal wiring efficiency (occupied area) are certain, and the amount of cross talks by changing the conventional not the oblong form where the neighborhood parallel to a substrate side is long but form for signal wire cross-sectional shape. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Crosstalk / NEXT / FEXT / Conductor Shape / Differential Line / High-Density Package |
| Paper # | EMCJ2014-94 |
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| Conference Information | |
| Committee | EMCJ |
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| Conference Date | 2015/1/15(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Electromagnetic Compatibility (EMCJ) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study of the High-Density Package of the Differential Transmission Line |
| Sub Title (in English) | |
| Keyword(1) | Crosstalk |
| Keyword(2) | NEXT |
| Keyword(3) | FEXT |
| Keyword(4) | Conductor Shape |
| Keyword(5) | Differential Line |
| Keyword(6) | High-Density Package |
| 1st Author's Name | Takashi KUWAHARA |
| 1st Author's Affiliation | Mitsubishi Electric Corporation() |
| 2nd Author's Name | Yoshihiro AKEBOSHI |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation |
| 3rd Author's Name | Seiichi SAITO |
| 3rd Author's Affiliation | Salesian Polytechnic |
| Date | 2015-01-23 |
| Paper # | EMCJ2014-94 |
| Volume (vol) | vol.114 |
| Number (no) | 398 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |