Presentation 2015-01-22
Co-Analysis for SI/PI Problems of Differential Line in Multi-layer PCB
Yuki KAWAMITSU, Yoshio KAMI, Kimitoshi MURANO, Fengchao XIAO,
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Abstract(in English) Recently, the PCB with multi-layer substrate (Multi-layer PCB) is extensively used with the trend of small size and high density of the electronic equipment. However, SI/PI problems such as resonances between the power and ground layers in the Multi-layer PCB may occur. In this study, a three-layer board consists of signal-power-ground layers with coupled two lines is considered. An equivalent circuit model is proposed for the coupled lines while considering the effect of the resonance between the power-ground layers. The validity of the equivalent circuit model is checked by comparing the transmission characteristics of differential signaling and single-ended signaling with the full-wave simulations. The transmission characteristics of differential signaling are also examined by changing the coupling degree. It is shown that the equivalent circuit model is valid, and if two lines are tightly coupled, the effect of the resonance to the transmission characteristics is small.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Signal integrity / Power integrity / SI / PI / Concurrent analysis / Co-analysis / Transmission line theory / Differential line
Paper # EMCJ2014-87
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Conference Information
Committee EMCJ
Conference Date 2015/1/15(1days)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Co-Analysis for SI/PI Problems of Differential Line in Multi-layer PCB
Sub Title (in English)
Keyword(1) Signal integrity
Keyword(2) Power integrity
Keyword(3) SI
Keyword(4) PI
Keyword(5) Concurrent analysis
Keyword(6) Co-analysis
Keyword(7) Transmission line theory
Keyword(8) Differential line
1st Author's Name Yuki KAWAMITSU
1st Author's Affiliation University of Electro-communication()
2nd Author's Name Yoshio KAMI
2nd Author's Affiliation University of Electro-communication
3rd Author's Name Kimitoshi MURANO
3rd Author's Affiliation Tokai University
4th Author's Name Fengchao XIAO
4th Author's Affiliation University of Electro-communication
Date 2015-01-22
Paper # EMCJ2014-87
Volume (vol) vol.114
Number (no) 398
Page pp.pp.-
#Pages 6
Date of Issue