| Presentation | 2014/12/12 SI/PI/EMI Simulation Techniques and Their Exploitation for Chip/Package/Board/Chassis Co-design : Multi-domain Simulation(Special Lecture) Hideki ASAI, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | |
| Date of Issue |
| Conference Information | |
| Committee | EMCJ |
|---|---|
| Conference Date | 2014/12/12(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromagnetic Compatibility (EMCJ) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | SI/PI/EMI Simulation Techniques and Their Exploitation for Chip/Package/Board/Chassis Co-design : Multi-domain Simulation(Special Lecture) |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Hideki ASAI |
| 1st Author's Affiliation | Research Institute of Electronics() |
| Date | 2014/12/12 |
| Paper # | |
| Volume (vol) | vol.114 |
| Number (no) | 381 |
| Page | pp.pp.- |
| #Pages | 74 |
| Date of Issue | |