Presentation 2014-11-26
Investigation of the area reduction of observation part and control part in TSV fault detection circuit
Youhei MIYAMOTO, Hiroyuki YOTSUYANAGI, Masaki HASHIZUME,
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Abstract(in English) Since delay caused by an open TSV is usually very small, it is defficult to detect. Therefore, we have proposed a TSV fault detection circuit considering the effects of adjacent TSVs. However, the previous detection circuit requires to add a FF for each TSV to select a target TSV. Therefore, the method results in large area overhead. In addition, the relation of resolution and circuit area of VDL(Vernier Delay Line) used as a delay detection circuit has not been evaluated. In this study, in order to decrease circuit area of the TSV fault detection circuit, we improved the control part using BSC(Boundary Scan Cell). In addition, we also evaluate the most suitable number of delay gates in the VDL for small circuit area.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) TSV(Through-Silicon-Via) / design for testability / delay fault / VDL(Vernier-Delay-Line)
Paper # VLD2014-72,DC2014-26
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Committee DC
Conference Date 2014/11/19(1days)
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Registration To Dependable Computing (DC)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Investigation of the area reduction of observation part and control part in TSV fault detection circuit
Sub Title (in English)
Keyword(1) TSV(Through-Silicon-Via)
Keyword(2) design for testability
Keyword(3) delay fault
Keyword(4) VDL(Vernier-Delay-Line)
1st Author's Name Youhei MIYAMOTO
1st Author's Affiliation Graduate School of Advanced Technology and Science, Univ.of Tokushima()
2nd Author's Name Hiroyuki YOTSUYANAGI
2nd Author's Affiliation Institute of Technology and Science, Univ. of Tokushima
3rd Author's Name Masaki HASHIZUME
3rd Author's Affiliation Institute of Technology and Science, Univ. of Tokushima
Date 2014-11-26
Paper # VLD2014-72,DC2014-26
Volume (vol) vol.114
Number (no) 329
Page pp.pp.-
#Pages 6
Date of Issue