Presentation 2014-11-28
A Test Point Insertion Method to Reduce Capture Power Dissipation
Yoshiyasu TAKAHASHI, Hiroshi YAMAZAKI, Toshinori HOSOKAWA, Masayoshi YOSHIMURA,
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Abstract(in English) In at-speed scan testing of deep sub-micron era, high power dissipation can occur by high launch-induced switching activity when the response to a test pattern is captured by flip-flops, resulting in excessive IR drop, which may cause significant capture-induced yield loss. It is known that test pattern manipulations methods using don't care identification and don't care filling are effective to reduce capture power dissipation. In this paper, we propose a novel control point insertion method to reduce capture power dissipation. Control points can increase the number of don't cares in high power test patterns. Experimental results show that the proposed method was effective for ISCAS'89 benchmark circuits.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) transition faults / capture power dissipation / control point insertion / don't care identification / don't care filling
Paper # VLD2014-99,DC2014-53
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Committee VLD
Conference Date 2014/11/19(1days)
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Registration To VLSI Design Technologies (VLD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Test Point Insertion Method to Reduce Capture Power Dissipation
Sub Title (in English)
Keyword(1) transition faults
Keyword(2) capture power dissipation
Keyword(3) control point insertion
Keyword(4) don't care identification
Keyword(5) don't care filling
1st Author's Name Yoshiyasu TAKAHASHI
1st Author's Affiliation Graduate School of Industrial Technology, Nihon University()
2nd Author's Name Hiroshi YAMAZAKI
2nd Author's Affiliation Graduate School of Industrial Technology, Nihon University
3rd Author's Name Toshinori HOSOKAWA
3rd Author's Affiliation College of Industrial Technology, Nihon University
4th Author's Name Masayoshi YOSHIMURA
4th Author's Affiliation Faculty of Computer Science and Engineering, Kyoto Sangyo University
Date 2014-11-28
Paper # VLD2014-99,DC2014-53
Volume (vol) vol.114
Number (no) 328
Page pp.pp.-
#Pages 6
Date of Issue