Presentation 2014-10-17
Evaluation methods of PIM performance of Printed circuit boards
Nobuhiro KUGA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This report summarizes the current status of evaluating method of PIM characteristics of Printed circuit boards.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Passive Intermodulation / copper clad laminates / printed circuit boards / mobile communications
Paper # EMD2014-64
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Committee EMD
Conference Date 2014/10/10(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Evaluation methods of PIM performance of Printed circuit boards
Sub Title (in English)
Keyword(1) Passive Intermodulation
Keyword(2) copper clad laminates
Keyword(3) printed circuit boards
Keyword(4) mobile communications
1st Author's Name Nobuhiro KUGA
1st Author's Affiliation Graduate School of Engineering, Yokohama National University()
Date 2014-10-17
Paper # EMD2014-64
Volume (vol) vol.114
Number (no) 257
Page pp.pp.-
#Pages 4
Date of Issue